Electronic Package Shielding Structure to Prevent Metal Burrs
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Solution Overview
Problem
The existing electronic package manufacturing processes face issues with metal burrs forming during the removal of shielding layers, leading to short circuits and production yield loss, particularly in semiconductor packaging, due to the continuous nature of shielding layers being broken by external forces.
Innovation Solution
The electronic package structure incorporates a substrate with a support structure that creates a discontinuous surface for the conductive element, preventing the formation of metal burrs by spacing the substrate from an external carrier and using a recessed design to avoid continuous deposition of the conductive material, thereby reducing the likelihood of short circuits and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a continuous shielding layer is deposited over the substrate and external carrier, then effective shielding between adjacent electronic components is achieved, but metal burrs form during package removal causing short circuits and production yield loss
Solution Approach 1:
The shielding layer is segmented into multiple discrete regions corresponding to individual electronic components rather than forming a continuous layer. This segmentation prevents metal burr formation during package removal while maintaining shielding effectiveness for each component, resolving the contradiction between reliable shielding and harmful burr generation
Solution Approach 2:
The shielding structure provides localized shielding properties at specific component locations rather than uniform continuous shielding. Each component receives appropriate shielding coverage while the spaces between components remain non-shielded, preventing burr formation in inter-component regions while maintaining local shielding quality where needed
2Reliability
If a continuous shielding layer is used, then comprehensive electromagnetic shielding is provided, but additional cleaning operations are required to remove metal burrs
Solution Approach 1:
The shielding layer is divided into discrete segments for each component, eliminating the need for post-deposition cleaning operations to remove metal burrs. This segmentation approach maintains electromagnetic shielding effectiveness while simplifying the manufacturing process by removing the burr cleaning step
Solution Approach 2:
The shielding layer pattern is pre-configured as discrete regions before deposition, preventing metal burr formation at the source rather than requiring subsequent cleaning operations. This preliminary design action eliminates the need for additional mechanical cleaning steps in the manufacturing process
3Ease of manufacture
If the substrate is placed directly on the external carrier, then manufacturing simplicity is maintained, but continuous shielding layer deposition occurs leading to metal burr formation
Solution Approach 1:
A spacing structure is introduced as an intermediary element between the substrate and external carrier. This mediator creates a physical gap that prevents continuous shielding layer deposition while maintaining manufacturing simplicity, as the spacing structure is easily integrated into the existing manufacturing process
Solution Approach 2:
The solution introduces a vertical dimension (spacing height) between the substrate and carrier to control shielding layer deposition. By utilizing this additional dimensional parameter, the process prevents metal burr formation without complicating the horizontal manufacturing layout or requiring complex process changes
4Reliability
If metal burrs are removed through additional cleaning operations, then short circuit risks are reduced, but production yield loss of 2% to 3% occurs
Solution Approach 1:
The shielding layer is segmented into discrete component-specific regions, which prevents metal burr formation at the source. This eliminates the need for post-deposition cleaning operations that cause production yield loss, thereby maintaining both short circuit prevention and high production yield
Solution Approach 2:
The design converts the potential harm of continuous shielding layer deposition into a benefit by intentionally creating discrete shielding regions. This approach uses the deposition process itself to achieve the desired segmented pattern, preventing metal burr formation while maintaining shielding effectiveness, thus improving both reliability and productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents metal burr formation, reduces the probability of short circuits, and increases the yield of electronic packages by ensuring a non-continuous conductive layer deposition and allowing for high-precision formation of the recessed structure, thus enhancing manufacturing efficiency and reducing additional operations.
Implementation Method 1
depositing a shielding layer
Data Source
AI summary
An electronic package structure and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate, a conductive element, and a support structure. The substrate has a bottom surface and a lateral surface angled with the bottom surface. The conductive element is on the lateral surface of the substrate. The support structure is on the bottom surface of the substrate and configured to space the bottom surface from an external carrier. A lateral surface of the support structure is spaced apart from the lateral surface of the substrate by a first distance.