Semiconductor Package EMI Shielding via Photodecomposable Release Layer
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Solution Overview
Problem
Existing semiconductor packages lack effective electromagnetic interference (EMI) shielding, which is crucial for high-performance and miniaturized electronic devices, leading to potential malfunctions and reliability issues.
Innovation Solution
A method of manufacturing semiconductor packages involves forming a preliminary electromagnetic shielding layer that covers the upper and side surfaces of the molding structures, followed by photodecomposing a release layer and separating adhesive layers to create individual semiconductor packages with integrated electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor packages are manufactured without electromagnetic shielding layers, then the manufacturing process is simpler and cost is lower, but electromagnetic interference shielding is insufficient leading to reliability issues
Solution Approach 1:
The release layer is formed in advance on the package substrate and connection terminals before the electromagnetic shielding layer is applied. This preliminary action enables the shielding layer to be formed conformally over complex three-dimensional structures including underfill regions, and allows for clean separation of individual packages afterward without damaging the shielding layer
2Reliability
If a conformal electromagnetic shielding layer is formed over complex three-dimensional structures including underfill, then complete EMI shielding is achieved, but the manufacturing process becomes more complex
Solution Approach 1:
The release layer serves as an intermediary between the package substrate and the electromagnetic shielding layer. It provides a planar working surface that simplifies the formation of the conformal shielding layer, while enabling clean separation afterward. This mediator allows the shielding layer to be formed easily over complex three-dimensional structures including molding compound and underfill regions
3Manufacturing precision
If individual packages are separated after forming the electromagnetic shielding layer, then each package has integrated shielding, but the separation process may damage the shielding layer
Solution Approach 1:
The release layer acts as a sacrificial intermediary that is removed by photodecomposition to enable clean separation of individual packages. This intermediary layer protects the electromagnetic shielding layer during the separation process, allowing packages to be divided without damaging the shielding layer, which remains intact on each separated package
4Reliability
If the adhesive layer thickness is increased to ensure proper bonding, then connection reliability is improved, but the package height increases
Solution Approach 1:
The adhesive layer thickness is precisely controlled within the range of 5-20 micrometers, optimizing the balance between bonding strength and package height. This parameter optimization ensures sufficient adhesive material for reliable bonding of connection terminals while maintaining compact package dimensions suitable for miniaturized electronic devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively shields electromagnetic waves, enhancing the reliability of electronic devices by preventing noise and malfunctions, while maintaining the integrity of the semiconductor package structure.
Implementation Method 1
forming a plurality of semiconductor packages by photodecomposing the release layer and separating the adhesive layer from each of the plurality of molding structures
Data Source
AI summary
A method of manufacturing a plurality of semiconductor packages includes preparing a plurality of molding structures each including a package substrate, at least one semiconductor chip attached onto the package substrate, a molding layer covering the package substrate and surrounding the at least one semiconductor chip, a plurality of package connection terminals attached to a lower surface of the package substrate, a release layer conformally covering the lower surface of the package substrate and conformally covering surfaces of the plurality of package connection terminals, and an adhesive layer covering the release layer, attaching the plurality of molding structures onto a support structure, forming a preliminary electromagnetic shielding layer covering an upper surface and side surfaces of each of the plurality of molding structures, and forming the plurality of semiconductor packages by photodecomposing the release layer and separating the adhesive layer from each of the plurality of molding structures.