Semiconductor Package Shielding Ring Structure for EMI Control
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Solution Overview
Problem
Semiconductor packages face challenges with electromagnetic interference (EMI) that can cause abnormal operation and poor performance, necessitating effective EMI shielding solutions.
Innovation Solution
The semiconductor package incorporates a substrate with a peripheral shielding ring embedded in the peripheral region, which is electrically connected to a metal interconnect structure and a lid, forming an EMI shielding structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shielding layer is disposed on the encapsulant to shield EMI, then EMI protection is improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The shielding structure is divided into multiple segments: a peripheral shielding ring embedded in the substrate, an internal shielding layer within the encapsulant, and an external metal shielding layer on the encapsulant surface. Each segment performs a specific shielding function, collectively providing comprehensive EMI protection while distributing the complexity across modular components.
Solution Approach 2:
The shielding structure employs a nested configuration where the peripheral shielding ring is embedded in the substrate, the internal shielding layer is embedded within the encapsulant, and the external metal shielding layer is disposed on the encapsulant surface. This nested arrangement maximizes shielding effectiveness within the available space while maintaining a compact overall structure.
2Object-affected harmful factors
If a comprehensive EMI shielding structure is implemented, then EMI protection is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The peripheral shielding ring is pre-formed and embedded within the substrate before the encapsulant is applied. The internal shielding layer is also prepared in advance and positioned within the encapsulant structure. These preliminary actions ensure proper alignment and reduce the precision requirements for subsequent assembly steps.
Solution Approach 2:
The encapsulant serves as an intermediary medium that houses both the internal shielding layer and provides a mounting surface for the external metal shielding layer. This intermediary structure simplifies the integration of multiple shielding components and reduces the direct precision requirements between distant shielding elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively shields the semiconductor package from EMI, ensuring stable operation and improved performance by providing a comprehensive EMI shielding solution.
Implementation Method 1
a peripheral shielding ring embedded within a peripheral region of the substrate... The lid is electrically connected with the peripheral shielding ring... effectively shields the semiconductor package from EMI
Implementation Method 2
the integrated circuit die is in thermal contact with the lid, and wherein a thermal interface material (TIM) layer is disposed between the integrated circuit die and the lid
Data Source
AI summary
A semiconductor package includes a substrate having a top surface and a bottom surface, and a vertical sidewall extending between the top surface and the bottom surface; an integrated circuit die mounted within a device region on the top surface of the substrate; a metal interconnect structure embedded within the device region of the substrate, wherein the integrated circuit die is electrically connected to the metal interconnect structure; and a peripheral shielding ring embedded within a peripheral region of the substrate. The peripheral region surrounds the device region. A lid is mounted on the top surface of the substrate. The lid is electrically connected with the peripheral shielding ring.