Semiconductor Package Compartment Shielding Using Zero-Ohm Resistors
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Solution Overview
Problem
Conventional compartment shielding in semiconductor packages increases manufacturing costs due to additional materials and processes, necessitating a need for improved and cost-effective shielding methods.
Innovation Solution
The use of zero-ohm resistors and a conductive shielding layer in combination with compartment shields formed between semiconductor components to reduce manufacturing complexity and costs while providing effective electromagnetic interference (EMI) shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional compartment shielding materials and processes are used, then EMI shielding effectiveness is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent combines multiple shielding functions into a single integrated compartment shield structure that simultaneously provides EMI shielding and physical compartmentalization. This merging eliminates the need for separate shielding materials and processes, reducing manufacturing complexity while maintaining shielding effectiveness.
Solution Approach 2:
The compartment shield is designed to serve multiple functions: it acts as both an EMI barrier and a physical divider between compartments. This multi-functionality allows a single structure to replace what would traditionally require multiple separate components, thereby reducing overall device complexity and manufacturing steps.
2Object-affected harmful factors
If conventional compartment shielding materials and processes are used, then EMI shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
By merging EMI shielding functionality with the compartment shield structure, the invention eliminates the need for additional shielding materials and deposition processes. This integration reduces material costs and manufacturing expenses while maintaining effective EMI protection.
Solution Approach 2:
The compartment shield structure inherently provides EMI shielding without requiring additional shielding layers or materials. The existing structural elements serve the dual purpose of physical division and electromagnetic protection, eliminating the need for separate shielding investments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and complexity while effectively shielding semiconductor components from EMI, enhancing the reliability and affordability of semiconductor devices.
Implementation Method 1
compartment shielding can be formed between the various groups of components to shield them from each other
Data Source
AI summary
A semiconductor device has a substrate. A first electrical component and second electrical component are disposed over the substrate. A zero-ohm resistor is disposed over the substrate between the first electrical component and second electrical component. An encapsulant is deposited over the substrate, first electrical component, second electrical component, and first zero-ohm resistor. An opening is formed through the encapsulant to the first zero-ohm resistor. A shielding layer is formed over the encapsulant and into the opening.