Package Shuttle Assembly for Thermal Expansion-Safe Handling
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Solution Overview
Problem
Semiconductor packages are prone to damage during transport due to mechanical shocks and thermal expansion, which can cause undesirable contact and misalignment.
Innovation Solution
A package shuttle with a lower shuttle assembly comprising a first lower shuttle structural element, an array of thermal interface material plates, an array of conductive plates, and a second lower shuttle structural element with shuttle openings, which allows for thermal coupling of semiconductor packages to a heater element while minimizing thermal expansion-induced mechanical damages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the package shuttle is heated to elevated temperatures during transport, then the semiconductor packages can be maintained at optimal operating temperature, but thermal expansion causes undesirable contact between package edges and shuttle structure
Solution Approach 1:
The patent applies beforehand cushioning by providing lateral gaps between the semiconductor packages and the shuttle structural elements, and by using compliant support structures that can accommodate thermal expansion. The shuttle is designed with sufficient clearance and flexible support mechanisms before heating occurs, preventing harmful contact during thermal expansion.
Solution Approach 2:
The patent uses thermal interface material plates as intermediaries between the heater element and the semiconductor packages, and employs compliant support structures as mediators between the packages and the rigid shuttle framework. These intermediary elements decouple the direct thermal and mechanical coupling, allowing temperature control while reducing harmful thermal expansion effects.
2Strength
If the package shuttle uses rigid structural elements for stable transport, then mechanical strength is improved, but thermal expansion causes misalignment and collision of semiconductor packages
Solution Approach 1:
The patent applies local quality by making different parts of the shuttle structure have different mechanical properties. The outer framework uses rigid materials for strength, while the internal support structures and elements in contact with packages use compliant materials with lower thermal expansion coefficients. This localized differentiation allows the rigid framework to provide strength while compliant elements maintain alignment precision during thermal cycling.
Solution Approach 2:
The patent employs composite material strategies by combining rigid structural elements with compliant support structures and thermal interface materials. The shuttle uses a composite construction where rigid aluminum or aluminum alloy components provide overall strength, while compliant polymers, elastomers, or foams provide thermal and mechanical compliance to prevent misalignment and collision during thermal expansion.
3Use of energy by moving object
If the package shuttle provides direct thermal coupling to heater element, then heating efficiency is improved, but thermal expansion of shuttle structure causes mechanical damage
Solution Approach 1:
The patent introduces thermal interface material plates as intermediary elements between the heater element and the semiconductor packages. These plates provide efficient thermal coupling for heating while being thermally compliant and having lower thermal expansion coefficients than the rigid heater element, thereby decoupling the thermal transfer function from harmful thermal expansion effects.
Solution Approach 2:
The patent applies parameter changes by selecting materials with different thermal expansion coefficients for different components. The heater element, support structures, and package mounting elements use materials whose thermal expansion characteristics are mismatched to prevent stress transmission. This parameter differentiation allows efficient heating while minimizing thermal expansion-induced mechanical damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The package shuttle effectively transports semiconductor packages while preventing thermal expansion-induced mechanical damages, ensuring reliable handling and processing of the packages.
Implementation Method 1
an array of thermal interface material plates, an array of conductive plates... configured to accommodate an array of semiconductor packages therein
Implementation Method 2
A package shuttle that is configured to transport semiconductor packages may undergo thermal expansion at elevated temperatures, which may cause undesirable contact between edges of the semiconductor packages and the package shuttle
Data Source
AI summary
A package shuttle includes a lower shuttle assembly including a first lower shuttle structural element, an array of conductive plates located over the first lower shuttle structural element, and at least one second lower shuttle structural element including an array of shuttle openings therethrough. The array of shuttle openings overlies the array of conductive plates and is configured to accommodate an array of semiconductor packages therein. The package shuttle may further include an upper shuttle assembly including an carrier substrate and an array of package clamps attached to a bottom surface of the carrier substrate. The array of package clamps is configured to mate with the lower shuttle assembly such that the lower shuttle assembly is secure against lateral movement relative to the upper shuttle assembly upon mating of the lower shuttle assembly with the upper shuttle assembly.