Semiconductor Package Side-Dam Structure for TIM Leakage Control
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Solution Overview
Problem
Liquid thermal interface materials used in chip package processes are prone to leakage due to mechanical or thermal stresses, leading to insufficient heat dissipation and potential damage to components, which affects product reliability and increases production costs.
Innovation Solution
A package structure and method that includes a substrate, semiconductor package, side dam, and flexible heat conductor, where the side dam forms a confining space around the semiconductor package and the flexible heat conductor is supported by the side dam and a heat sink, preventing leakage and ensuring effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid thermal interface materials are used for heat dissipation, then heat dissipation efficiency is improved, but leakage risk increases due to package component warpage
Solution Approach 1:
A gel frame is introduced as an intermediary component between the package component and the liquid thermal interface material. The gel frame acts as a barrier that prevents the liquid thermal interface material from leaking while still allowing heat transfer, thus resolving the contradiction between heat dissipation efficiency and leakage prevention
Solution Approach 2:
The gel frame is applied beforehand to the package component before applying the liquid thermal interface material. This preliminary protective layer cushions against potential warpage-induced leakage, ensuring that even when mechanical or thermal stresses occur, the liquid material remains confined
2Reliability
If gel frames or foam frames are added to prevent liquid thermal interface material leakage, then reliability is improved, but production cost and process complexity increase
Solution Approach 1:
The gel frame is designed to be self-adhering to the package component, eliminating the need for additional adhesive frames or complex assembly processes. The gel frame automatically conforms to the package component surface and provides leakage prevention without requiring extra steps for attachment or alignment
Solution Approach 2:
The invention changes the physical state parameter of the barrier material from solid (foam frame) to semi-solid gel, which allows the material to better conform to package component surfaces and provide more effective leakage prevention while simplifying the application process
3Ease of manufacture
If liquid thermal interface material is used without barriers, then production cost is reduced, but leakage due to warpage causes insufficient heat dissipation
Solution Approach 1:
The gel frame serves as a cost-effective intermediary that prevents leakage without requiring complex additional structures. It maintains the simplicity of the manufacturing process while ensuring adequate heat dissipation by preventing the liquid thermal interface material from migrating to areas where it cannot perform its heat transfer function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively confines the flexible heat conductor, reducing the risk of leakage and maintaining heat dissipation efficiency, thereby enhancing product reliability and reducing production costs by eliminating the need for additional adhesive frames.
Implementation Method 1
The flexible heat conductor is disposed on the upper surface. The first heat sink is disposed on the side dam and the flexible heat conductor
Data Source
AI summary
A package structure and method for fabricating the same are provided. The package structure includes a substrate, a semiconductor package, a side dam, a flexible thermal conductor and a first heat sink. The substrate has a first board surface. The semiconductor package has an upper surface, a lower surface and a side surface, and the semiconductor package is disposed on the first board surface. The side dam is formed on the first board to surround a first accommodating space for accommodating the semiconductor package. The side dam has a height that is higher than a height of the upper surface. The flexible heat conductor is formed on the upper surface. The first heat sink is disposed on the side dam. The first heat sink, the side dam and the semiconductor package jointly define a second accommodation space to confine the flexible heat conductor.