Electronic Package Shielding Layout for Side-Surface EMI Blocking
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Solution Overview
Problem
Conventional radio-frequency modules suffer from electromagnetic interference (EMI) that causes outward radiation, affecting other antenna components and preventing normal operation due to the lack of effective shielding.
Innovation Solution
An electronic package design featuring a carrier structure with a package module, shielding members comprising a metal sheet and shielding legs that cover the package module's side surfaces, and a heat dissipation member connected to the shielding member to block radiation and prevent EMI interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal frame is disposed on the circuit structure and electronic elements are cladded with encapsulation layer, then the electronic elements are protected from external EMI, but the circuit structure still generates outward radiation that affects other antenna components
Solution Approach 1:
The shielding structure is divided into two segments: an inner metal frame that protects electronic elements from external EMI, and an outer shielding member with shielding legs that blocks outward radiation from the circuit structure. Each segment addresses a specific direction of EMI interference, resolving the contradiction between protecting from external EMI and preventing outward radiation.
Solution Approach 2:
The shielding member with shielding legs is disposed over the metal frame and circuit structure, creating a nested shielding configuration. The inner metal frame is nested within the outer shielding member, forming multiple layers of protection that simultaneously address both external EMI protection and outward radiation blocking.
2Object-affected harmful factors
If shielding bodies are disposed on the circuit structure to surround electronic elements, then EMI protection is improved, but the side surfaces of the package module remain exposed to radiation
Solution Approach 1:
The shielding member extends the protection from the traditional planar metal frame to a three-dimensional structure with shielding legs that cover the side surfaces of the package module. This dimensional extension blocks radiation paths that were previously unshielded, resolving the contradiction between protecting electronic elements and blocking side surface radiation.
3Object-generated harmful factors
If a shielding member with shielding legs is disposed to cover the package module, then outward radiation is blocked, but the device complexity increases
Solution Approach 1:
The shielding member serves multiple functions: it acts as a EMI shield, provides structural support through its legs, and can be integrated with the carrier structure. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while achieving effective outward radiation blocking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively blocks outward radiation from the circuit structure, ensuring normal operation and improving the reliability of the product by shielding the package module's side surfaces and preventing electromagnetic interference from affecting other electronic components.
Implementation Method 1
a shielding member disposed on the carrier structure to cover the package module, wherein the shielding member comprises a metal sheet covering the electronic element and at least one shielding leg for supporting the metal sheet on the carrier structure
Data Source
AI summary
An electronic package is provided, in which a package module and a shielding member are disposed on a carrier structure, such that the shielding member covers a top surface and side surfaces of the package module to block the radiation outward from the package module and prevent problem that other electronic components on the carrier structure cannot be transmitted signals normally due to the electromagnetic interference of the package module.