Semiconductor Package Singulation with Opposed Saw and Laser Cuts
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The singulation process in semiconductor package manufacturing often damages external components due to collisions with cutting equipment, leading to reduced manufacturing yield.
Innovation Solution
A singulation technique involving a combination of sawing and laser cutting is used to form vertical surfaces on semiconductor packages, where sawing is performed from one direction and laser cutting from an opposing direction, creating distinct vertical surfaces with varying roughness patterns to avoid component damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional singulation cutting equipment is used to separate semiconductor packages, then manufacturing efficiency is maintained, but external passive components mounted on the package surface are damaged due to collisions with the cutting equipment
Solution Approach 1:
The singulation process is divided into two distinct stages: first, a sawing process that cuts through the lead frame while leaving a portion uncut, and second, a laser cutting process that completes the separation. This segmentation allows each process to be optimized independently, with the sawing process handling the robust metal frame and the laser process handling the delicate final separation that avoids component collision
Solution Approach 2:
The invention transitions from traditional single-direction cutting to multi-directional cutting. The sawing process cuts from a first direction to create initial separation, then laser cutting proceeds from a second direction (opposing the first) to complete the singulation. This multi-dimensional approach allows the cutting paths to be planned around external components, preventing collisions while maintaining manufacturing efficiency
2Strength
If sawing is used to cut through the metal frame, then structural separation is achieved, but the cutting process may collide with and damage external passive components
Solution Approach 1:
The sawing process performs preliminary cutting action by cutting through a portion of the metal frame from a first direction to create initial structural separation and expose a vertical surface. This preliminary action weakens the structural connection before the final laser cutting, allowing the subsequent laser process to complete the separation with minimal risk to external components
Solution Approach 2:
The partially cut metal frame acts as an intermediary structure between the two cutting processes. The first sawing process creates an intermediate state where portion of the frame is cut and a vertical surface is exposed, which then serves as the starting point for the second laser cutting process from the opposing direction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively protects external components by minimizing physical trauma, thereby enhancing manufacturing yield and ensuring the integrity of passive components like inductors and capacitors.
Implementation Method 1
laser cutting through the mold compound and a remainder of the metal frame from a second direction opposing the first direction to form a second vertical surface on the metal frame and a third vertical surface on the mold compound
Data Source
AI summary
In some examples, a method for manufacturing a semiconductor package comprises coupling first and second semiconductor dies to a metal frame; covering the first and second semiconductor dies and the metal frame with a mold compound; coupling first and second passive components to the first and second semiconductor dies, the first and second passive components on an external surface of the mold compound; sawing through a portion of the metal frame from a first direction to form a first vertical surface of the metal frame, the first vertical surface having a first roughness due to the sawing; and laser cutting through the mold compound and a remainder of the metal frame from a second direction opposing the first direction to form a second vertical surface on the metal frame and a third vertical surface on the mold compound, the second vertical surface having a second roughness due to the laser cutting and the third vertical surface having a third roughness due to the laser cutting.