Semiconductor Package Socket Layout for Low-Reflection Board Connections
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Solution Overview
Problem
Package-on-interposer (PoINT) technology in semiconductor devices experiences performance degradation due to additional impedance discontinuities and signal reflection as data rates increase, primarily because of the extra transition layers between the interposer, socket, and circuit board.
Innovation Solution
Bypassing the interposer for certain signals by directly connecting semiconductor packages to the circuit board through a socket, positioning components directly on the interposer, and reducing the number of transition layers to minimize impedance discontinuities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If PoINT technology is used to connect semiconductor packages to circuit boards, then device integration and flexibility are improved, but signal integrity and performance deteriorate due to additional impedance discontinuities and signal reflection
Solution Approach 1:
The patent segments the interconnection path by providing separate interconnect structures: first interconnects for signals passing through the interposer, and second interconnects for signals bypassing the interposer. This segmentation allows different signal paths to be optimized independently, resolving the contradiction between integration flexibility and signal integrity.
Solution Approach 2:
The patent introduces an interposer as an intermediary component with specific features (cutouts, openings) that mediates between the semiconductor package and circuit board. The interposer provides mechanical support and electrical interconnection while allowing selective signal bypass, thus maintaining both integration benefits and signal integrity.
2Adaptability or versatility
If additional transition layers are added between interposer, socket, and circuit board, then device functionality is enhanced, but signal reflection and impedance discontinuities increase
Solution Approach 1:
The patent extracts certain signals from the traditional path through the interposer and socket by providing direct interconnects from the semiconductor package to the circuit board. This extraction eliminates the harmful impedance discontinuities and signal reflection that would otherwise occur at the additional transition layers.
Solution Approach 2:
The patent adds a dimensional aspect to signal routing by creating a three-dimensional interconnection architecture where signals can travel through different paths (through the interposer, through the socket, or directly bypassing both). This multi-dimensional approach allows optimization of signal paths to minimize reflection while maintaining functionality.
Data Source
AI summary
Systems, apparatus, articles of manufacture, and methods to connect a semiconductor package to a circuit board are disclosed. An example apparatus includes an interposer having a first side and a second side opposite the first side. A semiconductor package couples to the first side of the interposer via first contacts on a first surface of the semiconductor package. The semiconductor package includes second contacts on the first surface of the semiconductor package. The second contacts spaced apart from the first contacts. The second contacts to electrically couple to third contacts in a socket dimensioned to receive the interposer and the semiconductor package.