Semiconductor Package Spacer Connectors for Standoff Height Control
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Solution Overview
Problem
Existing semiconductor packaging technologies face challenges in maintaining consistent standoff height and preventing solder bridging during the bonding process, which leads to manufacturing defects and reduced yield.
Innovation Solution
The use of spacer connectors with a larger diameter than functional connectors to maintain a desired minimum standoff height between package components, ensuring uniformity and preventing solder bridging during bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional bonding processes are used without spacer connectors, then the bonding process is simpler, but standoff height consistency deteriorates and solder bridging occurs
Solution Approach 1:
Spacer connectors are introduced as intermediary elements between functional connectors and package components. These spacer connectors physically maintain the desired standoff height during bonding and prevent direct contact between solder material and adjacent connectors, thereby eliminating solder bridging while preserving structural simplicity.
Solution Approach 2:
The connector structure is segmented into distinct functional components: functional connectors for electrical connection and spacer connectors for mechanical spacing. This segmentation allows each component to perform its specific function optimally without interfering with the other, achieving both precision and simplicity.
2Reliability
If spacer connectors with larger diameter are used, then solder bridging is prevented, but material usage and structure complexity increase
Solution Approach 1:
The connector system is divided into functional connectors (smaller diameter for electrical connection) and spacer connectors (larger diameter for spacing and protection). This segmentation allows the larger diameter spacer connectors to be used only where needed for standoff height maintenance, rather than increasing the diameter of all connectors throughout the package.
Solution Approach 2:
Spacer connectors serve as intermediary protective elements that prevent solder material from bridging between functional connectors. By placing these spacers at critical locations, the patent prevents defects without requiring all connectors to have increased material dimensions.
3Manufacturing precision
If minimum standoff height is maintained during bonding, then solder bridging is prevented, but manufacturing process complexity increases
Solution Approach 1:
Spacer connectors are pre-positioned on package components before the bonding process. This preliminary action establishes the desired standoff height in advance, eliminating the need for complex real-time control during bonding. The spacers act as physical guides that automatically maintain proper spacing throughout the bonding operation.
Solution Approach 2:
The spacer connectors serve as intermediary mechanical guides that simplify the bonding process by pre-defining the standoff height. Rather than requiring complex process control to maintain minimum spacing, the spacers physically enforce the correct distance, making the bonding process easier and more reliable.
Data Source
AI summary
A package includes a first package component; a second package component bonded to the first package component by a first plurality of solder connectors; and a first plurality of spacer connectors extending from the first package component to the second package component. A diameter of a spacer connector the first plurality of spacer connectors is larger than a height of a solder connector of the first plurality of solder connectors, and the first plurality of spacer connectors comprises a different material than the first plurality of solder connectors.