Semiconductor Package Structure With Metal Spacer Gap Control
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Solution Overview
Problem
Conventional semiconductor device packaging methods fail to precisely control parameters such as gap size within the package structure, which affects performance and durability, especially for optical devices like CMOS image sensors and charge-coupled devices, due to inherent deviations and tolerances in manufacturing processes.
Innovation Solution
The package structure incorporates metal components and interconnect structures within the lid to control the gap size by attaching them to the device, allowing precise adjustment of the gap width through the dimensions of these components, ensuring accurate spacing between the device and the lid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional molding methods are used to package semiconductor devices, then the packaging process is simple and fast, but the gap size and other parameters inside the package cannot be precisely controlled
Solution Approach 1:
A support structure is introduced as an intermediary component between the device and the lid to precisely control the gap size. The support structure includes a first portion attached to the device and a second portion attached to the lid, with a predetermined height that defines the gap dimension. This mediator enables precise gap control without requiring direct measurement or adjustment during molding.
Solution Approach 2:
The support structure is prepared in advance with a predetermined height before the packaging process. The first portion is attached to the device prior to molding, and the support structure's dimensions are pre-defined to ensure the desired gap size. This preliminary preparation eliminates the need for post-packaging adjustment and ensures consistent parameters.
2Reliability
If the gap size is not precisely controlled, then the manufacturing process is simpler, but the performance and durability of optical devices are compromised
Solution Approach 1:
The support structure serves as a mechanical intermediary that physically maintains the prescribed gap size between the device and lid. By attaching the first portion to the device and the second portion to the lid, it ensures consistent spacing that protects optical devices from damage while maintaining proper air flow and heat dissipation characteristics.
3Measurement precision
If deviations and tolerances accumulate in conventional methods, then the manufacturing process remains straightforward, but the derived parameters become incorrect or insufficiently precise
Solution Approach 1:
The support structure acts as a physical reference that eliminates cumulative tolerance errors. Instead of relying on multiple measurement and adjustment steps that accumulate deviations, the predetermined height of the support structure directly defines the gap size, ensuring high measurement precision while maintaining ease of manufacture through a single-step attachment process.
Data Source
AI summary
The present disclosure provides a package structure. The package structure includes a base, a device disposed on the base, a lid disposed over the base and the device and spaced apart from the device, and a first metal component disposed between the device and the lid, wherein the first metal component contacts the device and the lid. The present disclosure also provides a method for forming a package structure.