Electronic Package Spacer Recess for Multi-Chip Thermal Isolation
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Solution Overview
Problem
In multi-chip packages, the heat generated by high-power semiconductor chips can adversely affect the operation of low-power memory-type chips, leading to reliability issues due to inadequate thermal management.
Innovation Solution
An electronic package design featuring a spacer with a recess acting as a thermal insulation area between adjacent components, filled with air or an insulating material, which has a thermal conductivity less than the encapsulation layer, effectively preventing heat transfer from high-power to low-power components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are integrated into a single package to improve computational performance and signal integrity, then the package can have more I/O pins and reduced signal latency, but heat generated by high-power chips adversely affects the operation of low-power memory chips
Solution Approach 1:
The package is segmented into distinct thermal zones by introducing spacers between high-power and low-power chips. These spacers create physical separation that divides the package into isolated thermal environments, preventing heat from high-power chips from affecting memory chips while maintaining their functional integration within the same package.
Solution Approach 2:
Thermal spacers act as intermediary elements positioned between high-power and low-power chips. These spacers serve as thermal mediators that block heat transfer pathways, allowing electrical and mechanical integration while preventing thermal interference between different chip types with different thermal requirements.
2Measurement precision
If high-power chips are placed in close proximity to low-power chips to reduce trace distances, then signal integrity is improved, but thermal interference occurs between the chips
Solution Approach 1:
The package structure implements local quality differentiation by applying thermal spacers specifically at interfaces between high-power and low-power chips, while maintaining direct bonding and close proximity elsewhere. This localized thermal management approach preserves signal integrity where needed while providing thermal isolation where temperature differences are critical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively insulates high-power components from low-power ones, enhancing the reliability of the electronic package by preventing heat-induced operational issues.
Implementation Method 1
a recess is formed in the spacer and used as a thermal insulation area
Data Source
AI summary
An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.