Electronic Package Spacing Structure for Warpage Relief
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Solution Overview
Problem
The complexity and fragility of multi-chip packaging structures increase with the diversification of product functions, leading to issues such as warpage, delamination, and cracking, which compromise the reliability of electronic packages.
Innovation Solution
The electronic package includes a spacing structure with recesses formed between adjacent electronic elements, which enhances flexibility and compensates for thermal variations, preventing warpage and delamination. Conductive elements serve as external contacts, and a heat dissipation element covers the recesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are arranged on a substrate to increase I/O counts and computing power, then the functionality and integration density are improved, but the packaging structure becomes more fragile and prone to warpage and delamination
Solution Approach 1:
The patent divides the packaging structure into modular units by introducing spacing structures between adjacent electronic elements. Each electronic element is isolated by these spacing structures, creating segmented regions that can independently accommodate thermal expansion and warpage without affecting the entire package. This segmentation resolves the contradiction by maintaining structural integrity while supporting multiple chips for high functionality.
Solution Approach 2:
The spacing structures are strategically placed between adjacent electronic elements to provide localized support and stress relief. This local quality enhancement allows specific regions of the packaging structure to have different mechanical properties, with spacing structures providing flexibility where needed while maintaining overall structural stability, thus preventing delamination and cracking in high-functionality multi-chip configurations.
2Volume of moving object
If the packaging structure is miniaturized to reduce size, then the compactness is improved, but the structure becomes more fragile and deformation-resistant
Solution Approach 1:
The spacing structures are integrated within the limited space of the packaging substrate, nesting functional elements efficiently. The spacing structures are positioned in the gaps between electronic elements, maximizing space utilization while providing necessary mechanical support. This nested arrangement maintains structural strength in miniaturized packages without increasing overall volume.
Solution Approach 2:
The spacing structures are formed using composite materials or multi-layer constructions that provide high strength-to-volume ratio. These composite structures offer enhanced mechanical strength and deformation resistance while occupying minimal space, enabling the packaging structure to maintain integrity even when miniaturized for compact applications.
3Adaptability or versatility
If more semiconductor chips are added to meet varying specifications, then the adaptability is improved, but the overall package size increases and warpage-induced failures worsen
Solution Approach 1:
The spacing structures create segmented regions that allow each electronic element to be independently positioned and configured according to specification requirements. This segmentation enables flexible arrangement of chips to meet various I/O and computing power specifications while maintaining a compact overall footprint, as each segment can be optimized independently without increasing total package dimensions.
Solution Approach 2:
The spacing structures utilize the vertical dimension and lateral gaps between chips to provide stress relief and thermal management pathways. By exploiting three-dimensional space utilization rather than simply expanding the planar footprint, the package can accommodate multiple chips with varying specifications while controlling overall dimensions and preventing warpage-induced failures.
Data Source
AI summary
An electronic package is provided and includes a plurality of electronic elements, a spacing structure connecting each of the plurality of electronic elements, and a plurality of conductive elements electrically connected to the plurality of electronic elements and serving as external contacts. The spacing structure has a recess to enhance the flexibility of the electronic elements after the electronic elements are connected to one another, thereby preventing the problem of warpage. A method for fabricating the electronic package is also provided.