Package Stacking via Substrate Contact Extender
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Solution Overview
Problem
Current integrated circuit packaging systems face challenges in achieving simplified manufacturing processes, smaller dimensions, lower costs, increased functionality, and improved IO connectivity while maintaining reliability and yield, due to limitations in design flexibility and packaging methods.
Innovation Solution
The method involves providing a base substrate with a molded under-fill, forming a substrate contact extender through the under-fill, mounting a stack device, attaching a coupling connector from the extender to the stack device, and forming a base encapsulation that encapsulates the connector, allowing for direct stacking and reduced package profile without additional solder bump levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional packaging methods with multiple solder bump levels are used, then IO connectivity is achieved, but package profile height increases and manufacturing complexity increases
Solution Approach 1:
The patent transitions from vertical stacking with multiple solder bump levels to a horizontal planar arrangement where the substrate contact extender lies flat on the substrate surface. This dimensional change reduces the vertical profile height while maintaining electrical connectivity through the extender that extends from the substrate to contact the stack device.
Solution Approach 2:
The invention extracts and eliminates the intermediate solder bump level from the traditional packaging structure. By using the substrate contact extender that directly contacts the stack device without requiring solder bumps, the patent simplifies the structure and reduces the package profile height while maintaining the essential electrical connection function.
2Reliability
If traditional packaging methods with multiple process steps are used, then reliable electrical connections are achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the substrate contact extender formation with the existing substrate fabrication process. The extender is formed as an integral part of the substrate using the same semiconductor manufacturing techniques, eliminating the need for separate assembly steps and reducing manufacturing complexity while ensuring reliable electrical connections.
Solution Approach 2:
The substrate contact extender serves multiple functions: it provides electrical connection, mechanical support, and alignment features for the stack device. This multi-functionality reduces the number of separate components and process steps needed, simplifying manufacturing while maintaining connection reliability.
3Ease of manufacture
If design flexibility is limited in traditional packaging, then manufacturing is simplified, but functionality and adaptability decrease
Solution Approach 1:
The patent creates a dynamic and adaptable packaging system where the substrate contact extender can be configured in different patterns and arrangements to accommodate various stack device configurations. The extender design allows for different package types (e.g., Fan-in, package-in-package) without requiring fundamental changes to the manufacturing process, providing both simplicity and flexibility.
Solution Approach 2:
The substrate contact extender is segmented into multiple contact points that can be independently configured and positioned. This segmentation allows for flexible arrangement of stack devices in different patterns while maintaining a standardized manufacturing process, achieving both ease of manufacture and design adaptability.
Data Source
AI summary
An integrated circuit packaging system includes: providing a base substrate; applying a molded under-fill on the base substrate; forming a substrate contact extender through the molded under-fill and in direct contact with the base substrate; mounting a stack device over the molded under-fill; attaching a coupling connector from the substrate contact extender to the stack device; and forming a base encapsulation on the stack device, the substrate contact extender, and encapsulating the coupling connector.