Package Stacking with Support Recess for Board Level Reliability
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Solution Overview
Problem
Conventional semiconductor packaging systems face challenges in miniaturization, reliability, and cost-effectiveness, particularly in portable devices, where package level stacking and package-on-package designs encounter reliability issues and higher costs.
Innovation Solution
The method involves a base package carrier with an interposer and a base package encapsulation that includes a cavity for exposing the interposer and a support recess formed between a non-horizontal edge of the encapsulation and the cavity, enhancing structural stability and board level reliability by using a support structure within the recess.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If package level stacking or package-on-package designs are used to increase packaging density, then packaging density is improved, but reliability deteriorates
Solution Approach 1:
The package encapsulation is segmented to include a cavity and a support recess, separating the functions of exposing the interposer and providing structural support. This segmentation allows the support structure to be independently optimized for reliability while maintaining high packaging density through the cavity design.
Solution Approach 2:
A support structure is introduced as an intermediary element within the support recess to enhance board level reliability. This intermediary component mediates between the package encapsulation and the substrate, providing mechanical reinforcement without compromising the packaging density achieved through stacking.
2Volume of moving object
If conventional package level stacking is used to reduce device size, then device size is reduced, but structural stability deteriorates
Solution Approach 1:
The support recess is formed in a dimension within the package encapsulation body, creating an internal three-dimensional structure that provides structural stability without increasing the external footprint of the device. This allows miniaturization while maintaining structural integrity through internal geometric optimization.
Solution Approach 2:
The package encapsulation combines multiple functional regions (cavity and support recess) within a single molded structure, creating a composite design that integrates both interposer exposure and structural support functions. This composite approach maintains structural stability while enabling compact device sizing.
3Quantity of substance
If POP designs are used to increase packaging density, then packaging density is improved, but manufacturing cost increases
Solution Approach 1:
The cavity and support recess are merged into a single base package encapsulation structure formed by one molding operation. This combining of functions into a single molded part eliminates the need for separate manufacturing steps and assembly operations, thereby reducing manufacturing cost while achieving high packaging density.
Solution Approach 2:
The support recess is pre-formed during the molding of the base package encapsulation, before the interposer is mounted and before final assembly. This preliminary formation of the support structure eliminates subsequent machining or assembly steps, reducing manufacturing complexity and cost while enabling the high-density POP design.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a base package carrier; mounting an interposer over the base package carrier; forming a base package encapsulation over the base package carrier and the interposer with the base package encapsulation having a cavity for exposing the interposer; and forming a support recess in the base package encapsulation between a non-horizontal edge of the base package encapsulation and the cavity.