3D Stiffener Structure for Compact Semiconductor Package Reliability
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Solution Overview
Problem
Existing semiconductor packages face issues such as excess cost, decreased reliability, relatively low performance, and large package sizes, which hinder their effectiveness.
Innovation Solution
The implementation of 3D stiffener or lid configurations with improved adhesion strength and narrower footprints, along with a support structure that includes a support wall with a first ledge, first riser, and second ledge, and a support roof, to enhance warpage control and package reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional semiconductor package structures are used, then manufacturing is simpler, but adhesion strength is insufficient and warpage control is poor
Solution Approach 1:
The support structure is segmented into multiple functional components: a support wall with ledges and risers for lateral attachment, and a support roof for top surface coverage. This segmentation allows each component to perform its specific function optimally, improving overall adhesion strength while maintaining manufacturability through modular construction.
Solution Approach 2:
The support structure transitions from a conventional planar configuration to a three-dimensional architecture with vertical walls, lateral ledges, and a roof component. This dimensional enhancement provides multiple attachment surfaces and improves mechanical interlocking, thereby increasing adhesion strength without significantly complicating the manufacturing process.
2Reliability
If larger package sizes are used, then more space is available for components, but package footprint becomes too large
Solution Approach 1:
The invention utilizes the vertical dimension by implementing a support wall with multiple ledges at different heights and a support roof that extends upward from the substrate surface. This three-dimensional configuration provides adequate component mounting space and improves structural reliability without increasing the lateral footprint of the package.
Solution Approach 2:
The support structure is designed to nest efficiently over the substrate and electronic components, with the support wall conforming to the substrate edges and the support roof covering the components. This nested arrangement maximizes the use of vertical space while maintaining a compact lateral footprint.
3Stability of the object's composition
If conventional support structures are used, then manufacturing is easier, but warpage control is insufficient
Solution Approach 1:
The support structure is divided into a support wall with multiple ledges and risers, and a separate support roof component. This segmentation allows the structure to better conform to the substrate and distribute mechanical stresses more evenly, improving warpage control through enhanced structural stability.
Solution Approach 2:
The support wall incorporates curved transitions between ledges and risers, and the support roof is designed with a contoured surface that follows the natural warpage profile of the substrate. These curved features reduce stress concentration points and improve overall warpage control compared to sharp angular configurations.
Data Source
AI summary
In one example, a semiconductor device includes a first substrate with a first substrate top side, a first substrate bottom side opposite to the first substrate top side, a first substrate lateral side interposed between the first substrate top side and the first substrate bottom side, and a first substrate conductive structure. An electronic component is coupled to the first substrate top side and coupled to the first substrate conductive structure. A support includes a support wall having a first ledge coupled to the first substrate top side, a first riser coupled to the first substrate lateral side, and a second ledge extending from the first riser away from the first substrate lateral side. Other examples and related methods are also disclosed herein.