Semiconductor Package Stiffener Structure for CTE Mismatch Stress
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving reliable packaging techniques for semiconductor dies that provide structural stability, particularly due to the mismatch in coefficient of thermal expansion (CTE) between semiconductor components and wiring substrates, leading to stress and warpage issues during temperature changes.
Innovation Solution
The use of bottom and top stiffeners with higher Young's modulus and specific CTE values, positioned around the semiconductor component and conductor terminals, to reinforce the mechanical properties of the semiconductor package and mitigate stress caused by CTE mismatch, while maintaining electrical isolation and facilitating heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor components are integrated with higher density and miniaturization, then integration density improves, but structural stability and reliability deteriorate due to CTE mismatch and warpage
Solution Approach 1:
The patent introduces stiffener elements as intermediary components between the semiconductor die and the wiring substrate. These stiffeners act as mechanical mediators that absorb and distribute the stress caused by CTE mismatch, preventing direct transmission of warpage forces to the integrated circuit components while maintaining the high-density integration architecture.
Solution Approach 2:
The patent employs composite structural design combining the semiconductor die, wiring substrate, and stiffener elements into an integrated package structure. This composite approach allows each component to contribute its specific properties - the semiconductor die provides computational functionality, the wiring substrate provides electrical interconnects, and the stiffeners provide mechanical stability - collectively resolving the reliability issue while preserving integration density.
2Area of stationary object
If miniaturization is pursued to achieve smaller package size, then area reduces, but mechanical strength and resistance to warpage deteriorate
Solution Approach 1:
The patent applies local reinforcement by positioning stiffener elements at specific locations within the package structure where stress concentration occurs due to CTE mismatch. Rather than uniformly increasing the size of all components, the stiffeners are strategically placed to provide localized mechanical support, maintaining compact overall dimensions while enhancing resistance to warpage and mechanical failure.
3Ease of manufacture
If CTE mismatch between semiconductor components and wiring substrate is present, then integration is simplified, but stress and warpage increase during temperature changes
Solution Approach 1:
The patent incorporates stiffener elements as preventive measures during the packaging process, before thermal cycling occurs during operation. These stiffeners are pre-positioned to cushion and distribute the thermal stresses that will arise during temperature changes, preventing warpage and mechanical failure before they occur rather than attempting to correct them after the fact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the mechanical stability and reliability of semiconductor packages by preventing warpage and improving yield, ensuring reliable electrical connections and efficient heat management.
Implementation Method 1
mismatch in coefficient of thermal expansion (CTE) between semiconductor components and wiring substrates
Implementation Method 2
bottom and top stiffeners with higher Young's modulus and specific CTE values
Implementation Method 3
efficient heat management
Data Source
AI summary
A semiconductor package provided herein includes a wiring substrate, a semiconductor component, conductor terminals, a bottom stiffener and a top stiffener. The wiring substrate has a first surface and a second surface opposite to the first surface. The semiconductor component is disposed on the first surface of the wiring substrate. The conductor terminals are disposed on the second surface of the wiring substrate and electrically connected to the semiconductor component through the wiring substrate. The bottom stiffener is disposed on the second surface of the wiring substrate and positioned between the conductor terminals. The top stiffener is disposed on the first surface of the wiring substrate. The top stiffener is laterally spaced further away from the semiconductor component than the bottom stiffener.