Semiconductor Package Stiffener Hole Layout for Edge Stress Relief
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Solution Overview
Problem
Existing semiconductor packages face issues with reliability and durability due to stress-induced cracks and warpage caused by thermal expansion coefficient differences between components, particularly at the edge regions of the package substrate.
Innovation Solution
Incorporation of a stiffener structure with a hole and an adhesive layer on the package substrate, where the hole reduces the overlapping area and stress concentration, and the adhesive layer provides flexibility to counteract thermal expansion, enhancing the package's structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a stiffener structure is added to reduce warpage, then structural stability is improved, but stress concentration at edge regions increases
Solution Approach 1:
The stiffener structure is segmented by introducing holes that divide the continuous stiffener into sections. This segmentation reduces the overall stiffness in specific regions, thereby reducing stress concentration at edge regions while maintaining structural stability in the central area where the holes are not located.
2Strength
If the stiffener structure overlaps more with the package substrate, then structural support is improved, but thermal expansion stress increases
Solution Approach 1:
The stiffener structure is designed with non-uniform properties through the introduction of holes at specific locations (edge regions). This creates local variations in stiffness and thermal expansion characteristics, allowing the structure to have high structural support where needed (central region) while reducing thermal expansion stress at vulnerable edge regions.
3Ease of manufacture
If a solid stiffener structure is used, then manufacturing simplicity is maintained, but reliability under thermal stress decreases
Solution Approach 1:
The stiffener structure incorporates holes to create a porous or hollow configuration. This modification maintains relatively simple manufacturing processes while significantly improving reliability under thermal stress by reducing thermal expansion coefficients and preventing stress-induced cracks at edge regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress-induced cracks and warpage, thereby increasing the reliability and durability of the semiconductor package by balancing thermal expansion and maintaining structural stability.
Implementation Method 1
stress-induced cracks and warpage caused by thermal expansion coefficient differences between components
Implementation Method 2
the adhesive layer provides flexibility to counteract thermal expansion
Data Source
AI summary
Disclosed is a semiconductor package comprising a package substrate, a substrate on the package substrate, a first semiconductor chip mounted on the substrate, and a stiffener structure on the package substrate and having a hole. The stiffener structure is laterally spaced apart from the substrate. The hole penetrates a top surface of the stiffener structure and a bottom surface of the stiffener structure. When viewed in plan, the hole overlaps a corner region of the package substrate.