Electrical Device Package Structure Embedding in Dielectric Layer
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Solution Overview
Problem
Conventional methods for fabricating electrical device package structures are labor-intensive and struggle to minimize the overall thickness of these structures, as they involve separate fabrication of electrical devices and circuit boards, making it difficult to achieve miniaturization.
Innovation Solution
A method involving a circuit board with a substrate and conductive patterns, where an electrical device is embedded in a dielectric layer, and conductive vias are formed to connect the device's electrodes, reducing thickness by filling conductive material in caving patterns and removing the substrate, with solder masks exposing conductive patterns for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If electrical devices are packaged on circuit boards using conventional techniques, then the electrical devices can be supported and connected, but the overall thickness of the electrical device package structure increases
Solution Approach 1:
The patent merges the circuit board substrate and the electrical device packaging into a single integrated structure. The substrate serves both as the circuit board base and as the packaging structure for embedding electrical devices, eliminating the need for separate packaging layers and reducing overall thickness.
Solution Approach 2:
The patent embeds electrical devices directly within cavities formed in the substrate. The devices are nested inside the substrate structure rather than being mounted on top, with conductive vias penetrating through the substrate to establish electrical connections, thereby reducing the vertical thickness of the package structure.
2Productivity
If conventional packaging methods are used, then electrical devices can be supported on circuit boards, but the process is labor-intensive and time-consuming
Solution Approach 1:
The patent forms conductive vias and cavities in the substrate before embedding the electrical devices. This preliminary preparation of the substrate structure allows for automated placement and integration of devices, reducing manual labor and packaging time compared to conventional post-assembly wiring methods.
Solution Approach 2:
The patent replaces manual wiring and connection processes with automated conductive via formation through the substrate. The conductive material filling process and electrical connections are established through standardized manufacturing processes rather than labor-intensive hand-wiring, significantly improving productivity.
Data Source
AI summary
A method of packaging an electrical device including following steps is provided. A circuit board including a substrate and a first conductive pattern is provided. The electrical device having an electrode is disposed on the circuit board. A dielectric layer is formed on the circuit board to cover the electrical device, the electrode and the first conductive pattern, wherein a first caving pattern is formed in the dielectric layer by the first conductive pattern. The dielectric layer is patterned to form a through hole and a second caving pattern connecting with the through hole and exposing the electrode. A conductive material is filled in the through hole and the second caving pattern to form a conductive via in the through hole and a second conductive pattern in the second caving pattern. The substrate is removed.