Electronic Package Structure Heat Dissipation via Integrated Substrate

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Solution Overview

Problem

Conventional electronic package structures face challenges in effective heat distribution due to the circuit board's poor heat conductivity, which hinders the dissipation of heat from electronic elements to the copper substrate, leading to potential warpage and nonuniform heating.

Innovation Solution

An electronic package structure is designed with a substrate that combines a circuit board and a heat-dissipating plate, incorporating conductive nodes and thermal vias to facilitate heat dissipation, allowing for both high-density assembly and efficient heat management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a circuit board is used as the substrate, then the electronic package structure can accommodate circuit layout and electronic elements, but the heat conduction performance deteriorates leading to nonuniform heat dissipation

Engineering Contradiction:

Improvecircuit layout capabilityVSAvoidheat conduction performance

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent merges the circuit board and heat-dissipating plate into a single integrated substrate structure. The circuit board serves dual purposes: as the mounting platform for electronic elements and as a heat dissipation component. The bottom surface of the circuit board directly contacts the copper substrate, creating thermal pathways while maintaining circuit functionality.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The circuit board is designed to perform multiple functions simultaneously: electrical connection through circuit traces, mechanical support for electronic elements, and thermal conduction to the copper substrate. This multi-functionality eliminates the need for separate heat dissipation components while maintaining circuit adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If a copper substrate is used for heat dissipation, then the heat conduction performance improves, but the circuit layout capability deteriorates

Engineering Contradiction:

Improveheat conduction performanceVSAvoidcircuit layout capability

Core Design Contradiction:

TemperatureVSAdaptability or versatility

Solution Approach 1:

The invention combines the heat-dissipating plate with the circuit board to form an integrated substrate. The circuit board is positioned on the copper substrate with direct thermal contact, allowing the copper substrate to provide superior heat conduction while the circuit board maintains full circuit layout capabilities and electronic element mounting functionality.

Inventive Principle:

Principle #5Merging (Combining)

3Adaptability or versatility

If electronic elements are assembled on the circuit board, then the circuit functionality is achieved, but the heat dissipation efficiency deteriorates due to poor thermal contact with the copper substrate

Engineering Contradiction:

Improvecircuit functionalityVSAvoidheat dissipation efficiency

Core Design Contradiction:

Adaptability or versatilityVSLoss of energy

Solution Approach 1:

The circuit board acts as an intermediary component between the electronic elements and the copper substrate. It provides both the necessary circuit functionality for electronic elements and a thermal pathway to conduct heat from the elements to the copper substrate, improving overall heat dissipation efficiency while maintaining circuit operation.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat dissipation function is extracted from the traditional circuit board role and assigned to the copper substrate, while the circuit board focuses on providing circuit functionality and mechanical support. This separation of functions allows each component to optimize its specific role: the copper substrate for thermal management and the circuit board for electrical connectivity.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables uniform heat dissipation from electronic elements, preventing warpage and nonuniform heating by leveraging the circuit board's conductive pins and the heat-dissipating plate's efficiency, thus maintaining a compact and reliable package structure.

Implementation Method 1

the heat can be uniformly dissipated through the copper substrate 110 provided on the bottom of the device

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

the heat from the third electronic element is conducted from the first surface to the second surface through the heat-dissipating material

Methodology Applied

Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS8619428B2Electronic package structure

Publication Date: 2013.12.31 CYNTEC

AI summary

An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.