Package Structure Holes Eliminate Parasitic Inductance
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Solution Overview
Problem
Existing package structures experience significant high-frequency loss and performance degradation when operating frequencies exceed 6 GHz due to parasitic inductive effects caused by metal wires contacting the molding cap in surface mount technology.
Innovation Solution
The package structure incorporates holes formed within the die and routing layers using the hot via process to deliver signals, eliminating the need for wire bonding and reducing parasitic inductive effects, thereby minimizing high-frequency loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonding is used to connect die to leads, then ease of manufacture is improved, but high frequency loss increases due to parasitic inductive effects
Solution Approach 1:
The patent extracts and removes the metal wires from the package structure, replacing the wire bonding connection method with direct conductive connections through the lead frame. This eliminates the parasitic inductive effects caused by metal wires contacting the molding cap while maintaining manufacturing feasibility through standard lead frame bonding processes.
Solution Approach 2:
The patent replaces the mechanical wire bonding system with an electrical conduction system through the lead frame. Instead of using metal wires that create parasitic inductance, the signal transmission is achieved through conductive pathways integrated into the lead frame structure, substituting a problematic mechanical connection with a superior electrical conduction path.
2Speed
If operating frequency is increased above 6 GHz, then communication system performance is improved, but parasitic inductive effects increase causing performance degradation
Solution Approach 1:
The patent converts the harmful parasitic inductive effects into a benefit by completely eliminating the source of parasitic inductance (metal wires). By using lead frame-based conductive connections instead of wire bonding, the design transforms what would be a problematic high-frequency application into a reliable system that can operate above 6 GHz without performance degradation from parasitic effects.
3Ease of operation
If metal wires contact molding cap, then connection is established, but parasitic inductive effect is formed increasing with frequency
Solution Approach 1:
The patent extracts and removes the metal wires that cause parasitic inductive effects when contacting the molding cap. The connection functionality is maintained through alternative pathways using the lead frame's conductive structure, eliminating the harmful interaction between metal wires and the molding cap while preserving electrical connectivity.
Solution Approach 2:
The patent introduces the lead frame as an intermediary structure that provides conductive pathways for signal transmission. Instead of metal wires directly contacting the molding cap, the lead frame serves as a mediator that establishes connections between the die and external leads through its integrated conductive traces and bonding pads, avoiding parasitic inductance generation.
Data Source
AI summary
A package structure is disclosed. The package structure includes at least a lead, for delivering at least a signal; at least a routing layer, connected to the at least a lead, where at least a first hole is formed through the at least a routing layer; a die, disposed on the at least a routing layer, where at least a second hole is formed through the die, and the die generates or receives the at least a signal; and a molding cap, for covering the at least a routing layer and the die; where the at least a signal is delivered through the at least a first hole and the at least a second hole.