Electronic Package Structure with Nitrogen-Protected Seed Layer Adhesion
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Solution Overview
Problem
During the manufacturing of electronic device package structures, surface treatment to improve adhesion is compromised by exposure to atmospheric conditions, leading to defects such as water vapor intrusion and metal layer oxidation, which reduces the reliability and electrical properties of the device.
Innovation Solution
A manufacturing method involving a first plasma treatment of the insulating and metal layers followed by placement in a microenvironment controlling box to minimize oxidation and water vapor exposure, allowing for improved adhesion of subsequent seed layers and enhancing the reliability and electrical properties of the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If surface treatment is performed using a surface treatment device to remove residues and improve adhesion, then adhesion of the seed layer is improved, but exposure to atmospheric environment generates defects and oxides that reduce adhesion
Solution Approach 1:
The patent applies inert atmosphere by introducing a nitrogen-filled microenvironment controlling box between the surface treatment device and the coating device. The box maintains a nitrogen atmosphere (inert environment) to prevent oxidation and water vapor intrusion on the treated surface, thereby preserving adhesion quality while maintaining reliability.
2Adaptability or versatility
If the carrier plate is exposed to atmospheric environment for a long time between processes, then process flexibility is improved, but oxidation and water vapor intrusion occur that reduce adhesion
Solution Approach 1:
The microenvironment controlling box filled with nitrogen creates an inert atmosphere that protects the carrier plate surface during transport and waiting periods. This allows the process to maintain flexibility with separate devices while preventing oxidation and water vapor intrusion that would compromise adhesion.
3Ease of manufacture
If separate surface treatment device and coating device are used, then process independence is improved, but exposure time increases leading to oxidation and reduced adhesion
Solution Approach 1:
The nitrogen-filled microenvironment controlling box enables separate surface treatment and coating devices to operate independently while minimizing exposure time. The inert atmosphere protects the surface throughout the transport and waiting period, preventing oxidation even though exposure time is extended due to process independence.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures robust adhesion of seed layers, thereby improving the reliability and electrical properties of electronic devices by controlling the microenvironment to prevent oxidation and moisture intrusion, allowing for efficient and independent surface treatment and film formation processes.
Implementation Method 1
a first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer
Data Source
AI summary
A manufacturing method of a package structure of an electronic device, including the following steps, is provided. A first seed layer is formed on a carrier plate. A first metal layer is formed on the first seed layer. A first insulating layer is formed on the first metal layer, wherein the first insulating layer exposes a portion of the first metal layer. A first plasma treatment is performed on the first insulating layer and the exposed portion of the first metal layer. After performing the first plasma treatment, the carrier plate formed with the first seed layer, the first metal layer, and the first insulating layer is placed in a microenvironment controlling box. After taking the carrier plate out of the microenvironment controlling box, a second seed layer is formed on the first insulating layer and the exposed portion of the first metal layer.