Multi-Layer Package Structure for Thermal Warpage Mitigation
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Solution Overview
Problem
The expansion of high-end carrier areas to large-area applications is hindered by thermal deformation due to differing thermal expansion coefficients of materials, leading to warpage, delamination, circuit breakage, and solder ball damage during the process.
Innovation Solution
A package structure comprising a circuit board with multiple circuit structure layers, bridge structures, and supporting structures, where the bridge structures are connected between adjacent circuit layers and the supporting structures are located between them, with buffer layers and metal circuit layers to mitigate thermal deformation and ensure electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the carrier area is expanded to large-area applications, then the applicability scope is improved, but thermal deformation causes warpage and structural failure
Solution Approach 1:
The patent divides the large-area carrier into multiple separate circuit structure layers (first circuit structure layer and second circuit structure layer) connected by bridge structures. This segmentation allows each layer to be managed independently, reducing the overall warpage effect while maintaining large-area applicability. The carrier is split into discrete manageable units rather than a single continuous structure.
Solution Approach 2:
Bridge structures serve as intermediary elements connecting the first and second circuit structure layers. These bridge structures include buffer layers that act as mediators to accommodate thermal expansion differences between adjacent layers, preventing direct stress transmission that would cause warpage and structural failure in a monolithic design.
2Adaptability or versatility
If different materials with different thermal expansion coefficients are used, then functional performance is improved, but differential thermal deformation causes warpage
Solution Approach 1:
The patent applies different material properties to different parts of the structure. The buffer layers in the bridge structures have specific material characteristics designed to accommodate thermal expansion, while the circuit structure layers use materials optimized for their specific functions. This local differentiation of material properties allows each component to handle thermal stress appropriately.
Solution Approach 2:
The bridge structures are constructed as composite structures including buffer layers that combine materials with different thermal expansion coefficients. This composite design allows the bridge structure itself to accommodate differential thermal expansion between the circuit structure layers, preventing warpage while maintaining the functional benefits of using different materials.
3Ease of manufacture
If the circuit structure layers are made thinner for flexibility, then ease of manufacturing is improved, but susceptibility to damage increases
Solution Approach 1:
The bridge structures with buffer layers are positioned beforehand to provide cushioning and mechanical support to the thin circuit structure layers. This pre-positioned support structure protects the thin layers from damage during handling and assembly processes, enabling manufacturing of thinner structures without proportionally increasing vulnerability.
Solution Approach 2:
The patent employs thin film structures for the circuit structure layers while using the bridge structures with buffer layers to provide the necessary mechanical strength. The thin circuit layers maintain their flexibility and electrical functionality, while the supporting bridge structures prevent excessive deformation and damage during manufacturing and operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces warpage, prevents delamination and circuit breakage, and allows for thinner, more flexible circuit layers, enhancing the package structure's expandability and performance while reducing costs and improving repairability.
Implementation Method 1
the thermal deformation of each structure may be different due to difference in the thermal expansion coefficient of each material, causing warpage deformation of the structure
Data Source
AI summary
A package structure, including a circuit board, multiple circuit structure layers, at least one bridge structure, and at least one supporting structure, is provided. The circuit structure layer is disposed on the circuit board. The bridge structure is connected between the two adjacent circuit structure layers. The supporting structure is located between the two adjacent circuit structure layers, and the supporting structure has a first end and a second end opposite to each other and respectively connecting the bridge structure and the circuit board.