Package Structures Double-Sided Heat Dissipation
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Solution Overview
Problem
Conventional system-in-package (SIP) designs face challenges with limited heat dissipation due to the long heat dissipation path and high inductance caused by wire bonding, leading to large package size and significant power loss.
Innovation Solution
The package structure employs flip chip technology for direct electrode connections between active components and the substrate, along with metal parts on the opposite side for double-sided heat dissipation, reducing inductance and conduction loss, and incorporating a T-shaped metal pad for enhanced heat dissipation and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding process is used to connect active components to substrate, then electrical connectivity is achieved, but heat dissipation path becomes long and inductance increases
Solution Approach 1:
The invention divides the heat dissipation function into two separate paths: one through the substrate (bottom heat dissipation) and another through metal extensions on the top surface (side heat dissipation). This segmentation allows heat to be dissipated through multiple shorter paths simultaneously, reducing the overall thermal resistance and inductance compared to a single long wire bonding path.
Solution Approach 2:
The invention transitions from conventional single-plane wire bonding to a three-dimensional heat dissipation structure. Metal extensions protrude from the top surface of active components, creating vertical heat dissipation paths. This dimensional change enables heat to escape through the side surfaces rather than traveling long horizontal paths through wire bonds.
2Reliability
If wire bonding is used for connecting components, then electrical connection is established, but package size becomes large
Solution Approach 1:
The invention merges the electrical connection function with the heat dissipation function into a single integrated structure. The metal extensions serve dual purposes: providing electrical connectivity between active components and substrate while simultaneously acting as heat dissipation pathways. This eliminates the need for separate wire bonds, reducing overall package volume.
Solution Approach 2:
The metal extensions perform multiple functions: they provide electrical connection between components and substrate, serve as heat dissipation pathways, and act as structural support elements. This multi-functionality reduces the number of separate components needed, thereby reducing package size.
3Temperature
If conventional substrate copper layers are used for heat conduction, then heat dissipation is achieved, but heat conduction efficiency is limited by layer thickness and area
Solution Approach 1:
The invention enhances heat conduction by creating localized high-conductivity pathways. Instead of relying solely on the uniform but thin copper layers throughout the substrate, the invention concentrates high-conductivity metal materials in critical heat dissipation zones (the extensions on active component surfaces), providing efficient heat transfer paths where most needed.
Solution Approach 2:
The invention uses composite structures combining different metal materials with varying thermal and electrical conductivity properties. The metal extensions are made from materials optimized for heat dissipation, while the substrate provides complementary conductive pathways. This composite approach achieves superior overall heat conduction efficiency compared to single-material conventional designs.
4Reliability
If more wires and tighter wire spacing are used, then electrical connectivity is improved, but package size increases and inductance increases
Solution Approach 1:
The invention extracts the heat dissipation function from the wire bonding structure. Instead of using numerous wires for both electrical connection and heat dissipation, the invention removes the heat dissipation role from wires and assigns it to dedicated metal extensions. This extraction simplifies the wire bonding requirement, reducing wire quantity and spacing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact, high-efficiency heat dissipation system with reduced inductance and power loss, suitable for miniaturization and high breakdown voltage, while maintaining flexibility in circuit design and connectivity.
Implementation Method 1
The first surface of one metal part is connected to the second surface of one active component. Each metal part extends to connect to the first surface of the substrate. The second surface of each metal part and the second surface of the substrate are exposed from the encapsulation material.
Data Source
AI summary
A package structure is provided. The package structure includes a substrate, a plurality of active components, a plurality of separated metal parts and an encapsulation material. The substrate has a first surface and a second surface. Each active component has a first surface and a second surface. Each metal part has a first surface and a second surface. The first surface of each active component is connected to the first surface of the substrate. The first surface of one metal part is connected to the second surface of one active component. Each metal part extends to connect to the first surface of the substrate. The encapsulation material covers the first surface of the substrate and surrounds the active components and the metal parts. The second surface of each metal part and the second surface of the substrate are exposed from the encapsulation material.