Package Substrate Capacitance Layer Fabrication via Dielectric Filling
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Solution Overview
Problem
Conventional methods for fabricating IC carriers result in protruding parts within capacitance films, leading to heat and force accumulation, which can cause cracking or damage, thereby compromising transmission quality.
Innovation Solution
A method involving a substrate with a capacitance layer, patterned circuits, and a dielectric layer, where the dielectric layer is used to fill gaps and form through holes, insulating the conductive material and reducing heat and force accumulation on the capacitance layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to pattern the capacitance film, then the capacitance film can be formed, but protruding parts are generated inside through holes which accumulate heat and forces, causing cracking or damage
Solution Approach 1:
The method performs preliminary actions by forming the opening in the capacitance film before subsequent through-hole drilling and processing steps. This preliminary opening formation allows controlled removal of capacitance material without creating protruding parts that would accumulate heat and forces during later manufacturing steps, thereby preventing cracking or damage while maintaining manufacturing precision
Solution Approach 2:
The invention extracts the problematic protruding parts by selectively removing the capacitance film in the opening region before through-hole formation. This extraction eliminates the concentration points where heat and forces would accumulate during subsequent processing, preventing cracking while maintaining the structural integrity of the capacitance film
2Ease of manufacture
If the capacitance layer is patterned to form circuits, then electrical connections are established, but transmission quality deteriorates due to cracked or damaged holes
Solution Approach 1:
The opening is formed in the capacitance film before through-hole drilling and circuit patterning steps. This preliminary action ensures that subsequent processing does not create protruding parts that would crack or damage the capacitance film, thereby maintaining transmission quality while allowing standard circuit patterning processes to proceed
Solution Approach 2:
The method provides beforehand cushioning by creating a controlled opening that prevents stress concentration during subsequent manufacturing steps. This preliminary structural preparation cushions against the heat and forces generated during through-hole drilling and circuit formation, preventing cracking that would otherwise degrade transmission quality
Data Source
AI summary
Method of fabricating package substrates includes providing a substrate including a capacitance layer sandwiched between first patterned circuits and second patterned circuit, in which a gap is formed between adjacent two of the first patterned circuits, and exposed a first region of the capacitance layer, and the second patterned circuit is overlapped with the first region; removing a part of the capacitance layer within the first region, to form an opening communicated with the gap; forming a dielectric layer from a side of the capacitance layer disposed with the first patterned circuits to fill up the gap and the opening; and removing a part of the dielectric layer within the gap and the opening to form a through hole to expose a part of the second patterned circuit, the remaining part of the first dielectric layer covers the capacitance layer and the first patterned circuits.