Package Substrate Conductive Pillar Alignment
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Solution Overview
Problem
The existing package substrate fabrication methods are costly and time-consuming due to the need for expensive laser engraving processes to form opening windows and connection holes, which complicates the alignment and connection of circuit devices.
Innovation Solution
A package substrate design featuring a first and second conductive layer with conductive pillars and encapsulant material, where circuit devices are adhered directly to the conductive layer using a conductive pad, simplifying the alignment and reducing fabrication costs by eliminating the need for costly laser engraving.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser engraving process is used to form connection holes, then connection precision is improved, but fabrication cost increases and manufacturing time increases
Solution Approach 1:
The patent applies preliminary action by pre-forming conductive pillars on the substrate before mounting circuit devices. The conductive pillars are created in advance with precise positioning, eliminating the need for costly laser engraving to form connection holes later. This preliminary structure enables direct electrical connection when devices are mounted, reducing both cost and time while maintaining precision.
Solution Approach 2:
The patent extracts the connection hole formation step from the fabrication process by using pre-formed conductive pillars instead. The conductive pillars serve as ready-made connection structures, removing the need for laser engraving operations. This extraction eliminates the costly and time-consuming laser process while preserving the necessary connection functionality.
2Manufacturing precision
If laser engraving process is used to form opening windows, then alignment precision is improved, but fabrication cost increases and manufacturing time increases
Solution Approach 1:
The patent uses preliminary action by pre-forming conductive pillars at precise locations before device mounting. These pillars serve as alignment references and electrical connection points simultaneously. Circuit devices are mounted directly over the conductive pillars, achieving precise alignment without requiring laser engraving of opening windows, thus reducing manufacturing time while maintaining precision.
3Reliability
If core substrate process with opening windows is used, then device connection reliability is improved, but device complexity increases
Solution Approach 1:
The patent extracts the opening window formation step from the core substrate process by using pre-formed conductive pillars. The conductive pillars provide direct electrical connection paths without requiring complex opening window etching and alignment processes. This simplifies the overall device structure and fabrication process while maintaining reliable electrical connections between circuit devices and substrate.
4Reliability
If conventional package substrate fabrication is used, then connection reliability is improved, but productivity decreases
Solution Approach 1:
The patent applies preliminary action by pre-forming conductive pillars on the substrate before device mounting. This allows multiple circuit devices to be mounted simultaneously with precise electrical connections, eliminating the need for sequential laser engraving and alignment operations. The result is improved production efficiency while maintaining reliable connections, as the preparatory conductive structures enable faster assembly processes.
Data Source
AI summary
This disclosure provides a package substrate which includes: a first conductive layer having a first conductive area and a second conductive area; a package unit layer disposed on the first conductive layer and including a first circuit device having a first terminal connected to the first conductive area and a second terminal connected to the second conductive area, a first conductive pillar connected to the first conductive area, and an encapsulant material; and a second conductive layer disposed on the package unit layer and having a first metal wire connected to the first conductive pillar.