Cavity-Embedded Package Substrate Using Cured Resin for Void-Free Mounting

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Solution Overview

Problem

Existing methods for embedding electronic components in package substrates face challenges with void formation and delamination due to the difficulty in filling large cavities with conventional dielectric resins, especially with thick cores and large electronic components, leading to reduced performance and potential failure.

Innovation Solution

The use of a liquid resin dispensed within the cavity, which is partially cured to secure the electronic component in place, allowing for a more robust embedding by filling the cavity without voids and providing conductive paths through metallization structures, using materials like THP-100DX1 and PHP900 series resins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional dielectric resins are used to fill large cavities in thick cores, then the embedding process becomes difficult, but void formation and delamination occur

Engineering Contradiction:

Improveembedding reliabilityVSAvoidcavity filling difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the physical and chemical parameters of the resin material by using a two-part epoxy resin system that undergoes controlled curing. The resin is applied in a liquid state to fill the cavity completely, then cured to form a solid embedding medium. This parameter transformation from liquid to solid state enables complete cavity filling without voids while maintaining ease of application.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent uses a composite embedding structure consisting of the resin material combined with the electronic component. The two-part epoxy resin system itself represents a composite material approach, where the resin impregnates the component and fills the cavity to create a unified embedded structure that eliminates voids and prevents delamination.

Inventive Principle:

Principle #40Composite materials

2Reliability

If large electronic components are embedded in thick core substrates, then component positioning is challenging, but thermal and mechanical stress causes delamination

Engineering Contradiction:

Improvecomponent embedding stabilityVSAvoidbonding strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The patent applies preliminary action by first applying the liquid resin to the cavity before placing the electronic component. The resin is allowed to partially cure or set, creating a preliminary bonding layer that secures the component in position. This preliminary action ensures proper positioning and initial bonding strength before final curing, preventing delamination under thermal and mechanical stress.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The resin material serves as an intermediary substance between the electronic component and the substrate cavity. It fills the interface gaps, provides adhesive bonding, and distributes thermal and mechanical stresses uniformly. The resin acts as a mediator that prevents direct contact between the component and cavity walls, eliminating delamination risks while maintaining strong bonding.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If cavities are not completely filled with resin, then manufacturing is easier, but voids form reducing performance

Engineering Contradiction:

Improvecavity filling completenessVSAvoidembedding process efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The patent employs hydraulic principles by using the fluidity of the liquid resin to completely fill the cavity. The resin is applied in liquid form, allowing it to flow into and fill all spaces within the cavity uniformly. This hydraulic approach ensures complete filling without voids while maintaining manufacturing efficiency, as the liquid resin naturally conforms to the cavity shape without requiring complex filling mechanisms.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures a void-free embedding of electronic components, reducing the risk of delamination and enhancing the reliability and performance of the substrate by maintaining the component's position during thermal and mechanical stresses.

Implementation Method 1

a first cured resin layer, wherein the upper planar surface of the electronic component is at least partially embedded in the first cured resin layer

Methodology Applied

Scientific EffectCuring: Photopolymerisation

Data Source

PatentUS20240371737A1Package substrate having electronic component mounted in a cavity of a core of the package substrate with a resin

Publication Date: 2024.11.07 QUALCOMM INC

AI summary

In an aspect, an electronic device is disclosed that includes a substrate comprising a core having an upper planar surface and a lower planar surface, wherein the core includes a cavity extending through the core; an electronic component at least partially disposed in the cavity, wherein the electronic component has an upper planar surface having one or more electronic component terminals; a first cured resin layer, wherein the upper planar surface of the electronic component is at least partially embedded in the first cured resin layer at least at an upper portion of the cavity; and an upper metallization structure disposed over the upper planar surface of the core, wherein the upper metallization structure is configured to provide one or more conductive paths from the one or more electronic component terminals to one or more upper metal terminals of the upper metallization structure.