Package Substrate Dam Structure for Embedded Component Alignment
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Solution Overview
Problem
Existing package substrate manufacturing processes face challenges with component offset during resin coating due to hot-press flow, requiring nitrogen baking and additional roughening steps to ensure bonding, which increases thickness and complexity.
Innovation Solution
A package substrate design incorporating a dam structure within the dielectric layers to prevent component offset, eliminating the need for nitrogen baking and surface roughening, by using the dam to block resin flow and maintain component position during embedding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If nitrogen baking and roughening steps are added to prevent component offset, then bonding reliability is improved, but manufacturing complexity and process time increase
Solution Approach 1:
The dam structure is formed in advance during the substrate preparation phase, before component mounting. This preliminary structural preparation prevents the need for subsequent nitrogen baking and roughening steps, as the dam already provides the necessary constraints to prevent component offset during resin coating.
Solution Approach 2:
The invention extracts and removes the nitrogen baking and roughening steps from the manufacturing process by replacing them with the dam structure. This eliminates unnecessary process steps while maintaining bonding reliability, thereby reducing manufacturing complexity and process time.
2Strength
If nitrogen baking and roughening steps are performed, then bonding strength is improved, but substrate thickness increases
Solution Approach 1:
The dam structure is prepared in advance to provide mechanical constraints that prevent component offset. This eliminates the need for additional thickening layers that would result from nitrogen baking and roughening processes, maintaining substrate thickness while ensuring bonding strength through the dam's structural support.
3Manufacturing precision
If additional processing steps (baking, roughening) are added, then component positioning accuracy is improved, but manufacturing efficiency decreases
Solution Approach 1:
The dam structure is formed during substrate preparation, establishing precise component positioning constraints before component mounting. This preliminary positioning structure eliminates the need for subsequent baking and roughening steps, maintaining positioning accuracy while significantly improving manufacturing efficiency by reducing process steps.
Solution Approach 2:
The invention removes the time-consuming nitrogen baking and roughening steps from the manufacturing sequence by relying on the pre-formed dam structure for positioning accuracy. This extraction of unnecessary steps directly improves manufacturing efficiency while preserving component positioning precision through the dam's geometric constraints.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures strong bonding between dielectric layers without offset issues, simplifies the manufacturing process, and reduces the overall substrate thickness by maintaining component position during embedding.
Implementation Method 1
heating the second dielectric layer to restore a flow, and applying a pressure to the component to embed the component into the second dielectric layer
Data Source
AI summary
A package substrate includes a first dielectric layer, a first line layer provided on the first dielectric layer, the first line layer including a dam, a second dielectric layer provided on the first dielectric layer and covering the first line layer, a component embedded in the second dielectric layer and surrounded by the dam, and a third dielectric layer provided on the second dielectric layer and covering the component. By providing the dam, it can ensure a good bonding force between dielectric layers by using the dam to effectively avoid an offset problem of the components when the same is embedded in the second dielectric layer as well as omitting a step of baking roughening.