Package Substrate Assembly With Non-Solder Die Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional substrates for integrated circuit dies are limited by manufacturing, materials, and thermal considerations, constraining interconnect pitch and hindering efficient communication and power delivery between dies.
Innovation Solution
The use of a package substrate with conductive pathways and non-solder interconnects, such as DTPS and DTD interconnects, allows for secure attachment and efficient communication between multiple IC dies, supporting high-density interconnects and improved power delivery while accommodating differential thermal expansion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional substrates are used for coupling integrated circuit dies, then mechanical stability is achieved, but interconnect pitch is constrained by manufacturing, materials, and thermal considerations
Solution Approach 1:
The patent changes the material parameters of the substrate, transitioning from conventional substrates to a glass substrate with specific properties (low thermal expansion coefficient, high thermal conductivity). This parameter change enables finer interconnect pitch while maintaining manufacturability and thermal performance
Solution Approach 2:
The patent employs a composite substrate structure combining glass with metal interconnect layers and dielectric materials. This composite approach allows the substrate to simultaneously provide mechanical stability, thermal management, and support for high-density interconnects
2Power
If conventional substrates are used, then assembly is simplified, but thermal management and power delivery are insufficient for high-density interconnects
Solution Approach 1:
The patent changes the thermal parameters of the substrate by using glass with high thermal conductivity, enabling effective heat dissipation for high-density interconnects. The thermal conductivity parameter is specifically optimized to manage heat generated by multiple closely-spaced dies
Solution Approach 2:
The glass substrate serves multiple functions simultaneously: it provides mechanical support, thermal management, electrical isolation, and a platform for high-density interconnects. This multi-functionality resolves the contradiction between simplified assembly and advanced thermal/power capabilities
3Reliability
If multiple IC dies are attached with secure attachment, then reliability is improved, but cost increases and design flexibility decreases
Solution Approach 1:
The patent segments the attachment process into standardized steps: die attachment to the glass substrate, followed by wire bonding. This segmentation allows for reliable attachment while maintaining cost-effectiveness through process standardization and modularity
Solution Approach 2:
The glass substrate acts as an intermediary platform between multiple dies and the final package. It provides a stable, standardized interface that simplifies the attachment process and reduces overall manufacturing cost while maintaining high reliability
Data Source
AI summary
Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface, and a die secured to the package substrate, wherein the die has a first surface and an opposing second surface, the die has first conductive contacts at the first surface and second conductive contacts at the second surface, and the first conductive contacts are coupled to conductive pathways in the package substrate by first non-solder interconnects.