Package Substrate Dielectric Layer Material Selection
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Solution Overview
Problem
Conventional integrated circuit packages use a single midrange dielectric material for cost and stability, but this can impact performance as different components require either higher or lower dielectric constant materials for optimal electrical performance, leading to increased costs and structural instability when using exclusive higher or lower dielectric constant materials.
Innovation Solution
A package substrate with multiple different dielectric materials in the same dielectric layer, where one dielectric material has a mid-range dielectric constant and the other has either a higher or lower dielectric constant, selected based on specific application needs to enhance performance and reduce costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If higher dielectric constant material is used exclusively in package substrate, then electrical performance is improved, but cost increases and structural stability deteriorates
Solution Approach 1:
The patent applies local quality by using different dielectric constant materials in different regions of the package substrate. Specifically, higher dielectric constant material is used in regions requiring enhanced electrical performance (such as areas with dense interconnects or high-speed signaling), while lower dielectric constant material is used in other regions to maintain structural stability and control costs. This spatial differentiation of material properties resolves the contradiction between electrical performance and structural stability.
Solution Approach 2:
The patent employs composite materials by combining multiple dielectric layers with different dielectric constants within the same package substrate. The substrate includes a first dielectric layer with a first dielectric constant and a second dielectric layer with a second dielectric constant, where the ratio between the dielectric constants falls within a specific range (e.g., 0.5 to 2.0). This composite structure allows the package to achieve both improved electrical performance in critical areas and overall structural stability through the complementary properties of different materials.
2Reliability
If lower dielectric constant material is used exclusively in package substrate, then electrical performance for certain applications is improved, but cost increases and structural stability deteriorates
Solution Approach 1:
The patent applies local quality by using different dielectric constant materials in different regions of the package substrate. Specifically, higher dielectric constant material is used in regions requiring enhanced electrical performance (such as areas with dense interconnects or high-speed signaling), while lower dielectric constant material is used in other regions to maintain structural stability and control costs. This spatial differentiation of material properties resolves the contradiction between electrical performance and structural stability.
Solution Approach 2:
The patent employs composite materials by combining multiple dielectric layers with different dielectric constants within the same package substrate. The substrate includes a first dielectric layer with a first dielectric constant and a second dielectric layer with a second dielectric constant, where the ratio between the dielectric constants falls within a specific range (e.g., 0.5 to 2.0). This composite structure allows the package to achieve both improved electrical performance in critical areas and overall structural stability through the complementary properties of different materials.
3Stability of the object's composition
If midrange dielectric constant material is used in package substrate, then structural stability is maintained, but electrical performance for specific applications deteriorates
Solution Approach 1:
The patent applies local quality by using different dielectric constant materials in different regions of the package substrate. Specifically, higher dielectric constant material is used in regions requiring enhanced electrical performance (such as areas with dense interconnects or high-speed signaling), while lower dielectric constant material is used in other regions to maintain structural stability and control costs. This spatial differentiation of material properties resolves the contradiction between electrical performance and structural stability.
Solution Approach 2:
The patent employs composite materials by combining multiple dielectric layers with different dielectric constants within the same package substrate. The substrate includes a first dielectric layer with a first dielectric constant and a second dielectric layer with a second dielectric constant, where the ratio between the dielectric constants falls within a specific range (e.g., 0.5 to 2.0). This composite structure allows the package to achieve both improved electrical performance in critical areas and overall structural stability through the complementary properties of different materials.
Data Source
AI summary
A package substrate has a dielectric layer and a redistribution metal layer. The dielectric layer has a first dielectric material and a second dielectric material. The first dielectric material is different than the second dielectric material. The second dielectric material may have a dielectric constant that is either greater than or less than the dielectric constant of the first dielectric material. The second dielectric may be selected based on a specific target application such as single-ended signal routing or serializer/deserializer (SERDES) routing.