Standardized Package Substrate with Dummy Connectors

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Solution Overview

Problem

In conventional packaging processes, changes to the device die design often require redesigning the bottom package component, leading to increased costs and complexity due to the need for customized electrical interconnections.

Innovation Solution

The method involves forming package components with identical structures, where some electrical connectors are bonded actively and others as dummy connectors, allowing for reuse of design and reducing manufacturing costs by reserving additional connectors for future generations with simple modifications to the lithography masks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the bottom package component is customized according to the device die design, then the electrical interconnection is optimized for the specific device, but the design and manufacturing cost increases when the device die design changes

Engineering Contradiction:

Improveelectrical interconnection customizationVSAvoiddesign redesign frequency

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies universality by designing the bottom package component with a standardized electrical interconnection structure that can accommodate multiple device die designs. The package substrate includes a standard substrate with pre-defined electrical interconnections that serve multiple functions: supporting different device dies, providing consistent bonding interfaces, and enabling reuse across product generations. This standardized structure reduces the need for redesigning the bottom package component when device die designs change.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent segments the package assembly into distinct functional components: a standardized bottom package component and a device die. The bottom package component is further segmented into a standard substrate and a bonding structure. This segmentation allows the device die to be designed independently while the bottom package component maintains its standardized interface, enabling flexibility in device design without requiring changes to the bottom package component.

Inventive Principle:

Principle #1Segmentation

2Adaptability or versatility

If the bottom package component is redesigned for each device die design change, then the electrical interconnection is optimized, but the manufacturing cost and time increase

Engineering Contradiction:

Improveelectrical interconnection optimizationVSAvoidmanufacturing efficiency

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent applies preliminary action by pre-configuring the bottom package component with a standardized electrical interconnection structure before device die attachment. The standard substrate is manufactured with pre-defined bonding pads, electrical traces, and mechanical support structures that are ready to accommodate various device dies. This preliminary preparation eliminates the need for post-device design changes to the bottom package component, streamlining the manufacturing process.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent utilizes parameter changes by maintaining constant geometric and electrical parameters of the bottom package component's standard substrate while allowing variations in the device die parameters. The bonding structure dimensions, electrical trace layouts, and mechanical support features are standardized with fixed parameters, enabling the bottom package component to interface with device dies that have different parameters without requiring redesign.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If customized electrical interconnections are created for each device die, then the functional requirements are met, but the manufacturing complexity and cost increase

Engineering Contradiction:

Improveelectrical interconnection customizationVSAvoidmanufacturing simplicity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Productivity

If the bottom package component is standardized for reuse, then manufacturing cost decreases, but the ability to optimize electrical interconnection for specific device designs is reduced

Engineering Contradiction:

Improvedesign reuse efficiencyVSAvoidelectrical interconnection flexibility

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS9287246B2Package assembly and methods for forming the same

Publication Date: 2016.03.15 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A device includes a first package component, and a second package component underlying the first package component. The second package component includes a first electrical connector at a top surface of the second package component, wherein the first electrical connector is bonded to the first package component. The second package component further includes a second electrical connector at the top surface of the second package component, wherein no package component is overlying and bonded to the second electrical connector.