Package Substrate Embedded Wiring for Signal Consistency
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Solution Overview
Problem
Current package substrates face challenges in efficiently transmitting data between electronic components due to variations in signal line widths and thicknesses, leading to inconsistent signal processing times and potential slowdowns, especially when handling large amounts of information.
Innovation Solution
A printed wiring board design featuring a first resin insulating layer with a dedicated second conductor layer embedded within a second resin insulating layer, which reduces the distance between electronic components and the wiring layer, and includes a third conductor layer for power supply, all connected by via conductors, ensuring uniform signal transmission speeds by maintaining consistent line widths and thicknesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a roughened layer is provided on all conductor layers to improve adhesion, then adhesion reliability is improved, but manufacturing complexity and time increase due to additional processing steps
Solution Approach 1:
The patent applies roughened layers selectively only to specific conductor layers that require enhanced adhesion, rather than uniformly to all conductor layers. This localized approach maintains adhesion reliability where needed while reducing unnecessary processing steps and manufacturing complexity in other areas.
2Adaptability or versatility
If signal lines have varying widths and thicknesses to accommodate different routing needs, then routing flexibility is improved, but signal transmission consistency deteriorates due to inconsistent signal processing times
Solution Approach 1:
The patent controls the thickness parameter of the resin insulating layer to maintain consistent signal transmission characteristics across different signal lines, while still allowing width variations for routing flexibility. By carefully managing the insulating layer thickness, the patent ensures uniform signal processing times despite different line widths.
3Speed
If the distance between electronic components and wiring layers is reduced to improve signal transmission speed, then signal transmission speed is improved, but insulation reliability may deteriorate
Solution Approach 1:
The patent optimizes the thickness parameter of the resin insulating layer to achieve the right balance between reducing distance for faster signal transmission and maintaining sufficient insulation thickness for reliability. By precisely controlling this parameter, the patent achieves both speed and insulation reliability goals.
Data Source
AI summary
A printed wiring board includes a first insulating layer, a first conductor layer formed on first surface of the first insulating layer, a second conductor layer formed on second surface of the first insulating layer, a first via structure formed in the first insulating layer such that the first via structure is connecting the first and second conductor layers, a second insulating layer formed on the second surface of the first insulating layer such that the second conductor layer is embedded into the second insulating layer, a third conductor layer formed on the second insulating layer, and a second via structure formed in the second insulating layer such that the second via structure is connecting the second and third conductor layers. The second conductor layer includes a dedicated wiring layer which transmits data between two electronic components to be mounted to the first surface of the first insulating layer.