Package Substrate Hybrid Etching Cost Reduction

The patent replaces the expensive electroplating process with a cost-effective hybrid etching method using disposable chemical etchants. The etching process uses inexpensive chemical solutions to remove material and form conductive patterns, eliminating the need for costly electroplating equipment and materials while achieving the required manufacturing precision for conductive wire layers.

The patent substitutes the electrochemical electroplating system with a chemical etching system. Instead of using electrical current to deposit metal layers, the invention employs chemical etchants to selectively remove material and define conductive patterns, replacing a complex electrochemical system with a simpler chemical process that reduces manufacturing costs.

The patent optimizes etching parameters including etchant concentration, temperature, etching time, and substrate preparation conditions to achieve precise control over the etching process. By carefully adjusting these parameters, the hybrid etching method achieves manufacturing precision comparable to electroplating while maintaining lower manufacturing costs through the use of chemical rather than electrochemical processes.

The patent employs preliminary substrate preparation steps including surface cleaning, activation, and masking before the etching process. These preliminary actions ensure that the etching occurs only in desired locations with precise boundaries, maintaining manufacturing precision while using the cost-effective chemical etching method instead of electroplating.