Package Substrate Inductor Thermal Interconnect Structures
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Microelectronic packages with embedded inductors face limitations in processor current levels due to inductor current limits, leading to reduced performance and the need for thermal management to prevent damage from excessive heat.
Innovation Solution
Incorporating thermal interconnect structures between the inductor and board conductive features within the package substrate, which are thermally conductive materials like solder balls, to efficiently dissipate heat and allow higher current operation without damaging the inductor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inductor current limits are reduced to avoid damage, then inductor reliability is improved, but processor performance deteriorates due to reduced current delivery capability
Solution Approach 1:
The patent segments the thermal management function from the inductor structure by introducing separate thermal interconnect structures (thermal vias, thermal pads) that are distinct from the electrical inductor windings. This allows the inductor to operate at higher currents while dedicated thermal paths handle heat dissipation independently, resolving the contradiction between reliability and performance.
Solution Approach 2:
The patent introduces thermal interconnect structures as intermediary elements between the inductor and the substrate/heat sink. These thermal vias and pads act as mediators that conduct heat away from the inductor, enabling higher current operation without compromising inductor reliability, thus resolving the performance-reliability tradeoff.
2Productivity
If inductor current limits are increased to improve processor performance, then productivity is improved, but inductor temperature increases causing potential damage
Solution Approach 1:
The patent extracts the thermal management function from the inductor structure itself and implements it through separate thermal interconnect structures. By taking out the heat dissipation function and implementing it independently through thermal vias and pads connected to external heat sinks, the inductor can operate at higher currents without temperature-induced damage, resolving the contradiction between productivity and temperature control.
3Productivity
If thermal management structures are added to enable higher current operation, then processor performance is improved, but device complexity increases
Solution Approach 1:
The patent implements multi-functionality by designing thermal interconnect structures that serve dual purposes: they provide thermal pathways for heat dissipation while also serving as electrical interconnects for power and signal routing. This universal approach allows higher current operation without proportionally increasing device complexity, as the same structures fulfill multiple functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables increased current delivery to the die, enhancing CPU performance by maintaining acceptable inductor temperatures during peak demand, thus preventing throttling and extending high-current operation times.
Implementation Method 1
Incorporating thermal interconnect structures between the inductor and board conductive features within the package substrate, which are thermally conductive materials like solder balls, to efficiently dissipate heat
Data Source
AI summary
Embodiments include a microelectronic device package structure having an inductor within a portion of a substrate, wherein a surface of the inductor is substantially coplanar with a surface of the substrate. One or more thermal interconnect structures are on the surface of the inductor. A conductive feature is embedded within a board, where a surface of the conductive feature is substantially coplanar with a surface of the board. One or more thermal interconnect structures are on the surface of the conductive feature of the board, where the thermal interconnect structures provide a thermal pathway for cooling for the inductor.