Package Substrate Lamination for Thin, Warp-Resistant Interconnects
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Solution Overview
Problem
The production of thinner package substrates for semiconductor devices faces challenges such as reduced handling properties and increased warpage, leading to lower yields due to the temporary reduction in stiffness during processing steps like hole drilling and plating.
Innovation Solution
A method involving the formation of a first substrate with a peelable metal layer, followed by electrolytic or electroless copper plating to connect metal layers, and subsequent peeling to form a connected laminate, which reduces the need for hole drilling and minimizes stiffness-related issues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package substrate is made thinner to meet compactness requirements, then the compactness and functional density are improved, but the stiffness is reduced leading to increased warpage and handling damage
Solution Approach 1:
The invention performs preliminary lamination of the insulating layer and metal foil to form a laminate structure before the substrate is fully processed. This preliminary action creates a more robust intermediate structure that maintains stiffness during subsequent handling and processing steps, preventing warpage and damage even when the final substrate is very thin (40 μm or less).
Solution Approach 2:
The invention uses a composite structure consisting of an insulating layer (such as prepreg) and metal foil laminated together to form a laminate. This composite material approach provides both the thinness required for compact packages and the structural integrity needed to prevent warpage and handling damage during manufacturing processes.
2Manufacturing precision
If conventional hole drilling and plating steps are performed on thin laminates, then interlayer connections are achieved, but the reduced stiffness causes warpage and handling damage
Solution Approach 1:
The invention performs preliminary lamination to create a reinforced laminate structure before conducting hole drilling and plating operations. This preliminary structural preparation ensures that the substrate maintains sufficient stiffness during the interlayer connection process, preventing warpage and handling damage while still achieving the required manufacturing precision for reliable interlayer connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the handling properties and yield of package substrates by maintaining layer connectivity after peeling, reducing warpage and damage, and improving the efficiency of the manufacturing process.
Implementation Method 1
carrying out electrolytic copper plating and/or electroless copper plating on an inner wall of the non-through hole, and connecting the second metal layer and the first metal layer
Implementation Method 2
carrying out electrolytic copper plating and/or electroless copper plating on an inner wall of the non-through hole, and connecting the second metal layer and the first metal layer
Implementation Method 3
a second substrate forming step (c) of forming a second substrate by heating and pressurizing a laminate formed by arranging a second insulating resin layer and a third metal layer in this order on a surface of the second metal layer of the first substrate
Data Source
AI summary
A method for manufacturing a package substrate including an insulating layer and a wiring conductor, including: forming, on one or both sides of a core resin layer, a substrate including a peelable first metal layer that has a thickness of 1-70 μm, a first insulating resin layer, and a second metal layer; forming a non-through hole reaching a surface of the first metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and first metal layers; arranging a second insulating resin layer and a third metal layer and heating and pressurizing the first substrate to form a substrate; forming a non-through hole reaching a surface of the second metal layer, performing electrolytic and/or electroless copper plating on its inner wall, and connecting the second and third metal layers; peeling a third substrate; and patterning the first and third metal layers to form the wiring conductor.