Package Substrate With Embedded Magnetic Layer Alignment Window
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Solution Overview
Problem
Electronic device packages face challenges in achieving thin thickness, multiple functions, high performance, and low power consumption due to the increased thickness caused by active and passive components, which complicates the compactness requirement of consumer electronics and communication products.
Innovation Solution
A package substrate with an embedded electronic component featuring a magnetic layer partially covering a conductive wire, including an alignment window and recess to expose specific surfaces for accurate alignment and connection, allowing for a conductive trace to be formed, thereby reducing overall thickness and enhancing adhesion and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If active components and passive components are equipped in electronic device packages to achieve multiple functions and high performance, then the functional performance is improved, but the overall thickness of the package increases
Solution Approach 1:
The patent transitions from planar surface mounting to three-dimensional embedded mounting within the substrate thickness. Electronic components are positioned inside cavities formed in the substrate, utilizing the vertical dimension to accommodate components without increasing the package footprint, thereby resolving the contradiction between functional density and thickness.
Solution Approach 2:
The patent implements nested structures where electronic components are embedded within cavities in the substrate, and conductive traces are formed within recesses in the magnetic layer. This nesting approach allows multiple functional layers to be stacked vertically, achieving multiple functions while maintaining compact thickness.
2Ease of operation
If the magnetic layer is completely removed to expose the conductive wire, then the connection accessibility is improved, but the alignment precision deteriorates
Solution Approach 1:
The patent applies local quality by selectively removing the magnetic layer only in specific regions where conductive traces need to be formed. The magnetic layer is preserved in other areas to maintain alignment marks, creating different local properties: exposed conductive wire areas for connection and covered areas with alignment marks for positioning.
Solution Approach 2:
The patent segments the magnetic layer removal process into distinct regions: alignment window areas where the magnetic layer is removed to expose alignment marks, and recess areas where the magnetic layer is removed to expose conductive wires for tracing. This segmentation allows simultaneous preservation of alignment functionality and connection accessibility.
3Ease of manufacture
If the magnetic layer is recessed to expose the conductive wire surface, then the conductive trace formation is facilitated, but the adhesion strength may be reduced
Solution Approach 1:
The patent performs preliminary action by forming recesses in the magnetic layer before depositing conductive traces. This pre-formed recess structure provides a prepared pathway and surface for trace formation, facilitating easier manufacturing while the recess geometry is designed to maintain adhesion through surface area retention.
Data Source
AI summary
The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate. The electronic component includes a conductive wire comprising an alignment mark section and a connection section, and a magnetic layer partially covering the conductive wire. The magnetic layer includes an alignment window disposed in an upper surface of the magnetic layer and exposing a first upper surface of the alignment mark section, and a recess disposed in the upper surface of the magnetic layer and exposing a second upper surface of the connection section. The conductive trace is in the recess and electrically connected to the second upper surface of the connection section of the conductive wire.