Package Substrate With Offset Core Pads For High Density Interconnects
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Solution Overview
Problem
Conventional package substrates with build-up circuit structures struggle to support high-density wiring schemes required for advanced electronic components, failing to meet demands for greater integration and miniaturization while maintaining a simple manufacturing process.
Innovation Solution
A package substrate design featuring a redistribution structure with a core that has core pads directly bonded to bonding pads without foreign materials, where the core pads are offset from the bonding pads, reducing dimensional tolerance and manufacturing costs, and utilizing a core with a higher Young's modulus for enhanced mechanical stability and electrical signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional build-up circuit structures are used, then the manufacturing process remains simple, but the substrate cannot support high-density wiring schemes
Solution Approach 1:
The substrate is divided into a core region and a build-up region with distinct functions. The core provides mechanical support and contains through-silicon vias for vertical interconnections, while the build-up region implements the high-density wiring scheme with multiple conductive layers and redistribution structures. This segmentation allows each region to be optimized independently.
Solution Approach 2:
The patent transitions from planar 2D circuit layouts to 3D stacked architectures with multiple conductive layers at different heights. Through-silicon vias provide vertical interconnections between layers, enabling high-density interconnections in the third dimension while maintaining a compact footprint.
2Manufacturing precision
If finer interlayer connection is implemented for high-density wiring, then circuit density increases, but manufacturing complexity increases
Solution Approach 1:
The core is prepared in advance with pre-formed through-silicon vias and bonding pads at precise locations. This preliminary preparation establishes the foundation for subsequent build-up processes, ensuring that fine interlayer connections align with predetermined high-precision reference structures rather than being formed de novo at high density.
Solution Approach 2:
The core acts as an intermediary structure that mediates between the substrate and the high-density build-up region. It provides mechanically robust through-silicon vias and bonding pads that serve as stable reference structures, simplifying the alignment and fabrication of finer interlayer connections in the build-up region.
3Ease of manufacture
If core pads are directly bonded to bonding pads without foreign materials, then manufacturing complexity reduces, but dimensional tolerance requirements increase
Solution Approach 1:
The bonding pad on the build-up structure is designed with an asymmetric layout relative to the core pad, with the bonding pad extending beyond the core pad boundaries. This asymmetric design creates an overlapping region that provides alignment tolerance, allowing direct bonding without foreign materials while maintaining manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves robust high-density interconnections with improved mechanical stability and reduced manufacturing complexity, enabling high-quality electrical signal transmission and lower warpage.
Implementation Method 1
The core has a first core pad disposed on the first core surface and directly bonded to the bonding pad
Implementation Method 2
utilizing a core with a higher Young's modulus for enhanced mechanical stability and electrical signal transmission
Implementation Method 3
achieving robust high-density interconnections with improved mechanical stability and reduced manufacturing complexity, enabling high-quality electrical signal transmission
Data Source
AI summary
A package substrate including a first redistribution structure, a first bonding layer, a core, a second bonding layer and a second redistribution structure in a sequential order is provided. The first redistribution structure has a first redistribution surface and a first bonding pad disposed on the first redistribution surface. The second redistribution structure has a second redistribution surface and a second bonding pad disposed on the second redistribution surface. The core has a first core pad disposed on a first core surface, and a second core pad disposed on a second core surface opposite to the first core surface. The first core pad and the second core pad are directly bonded to first bonding pad and the second bonding pad, respectively. The first core pad and the second core pad are offset from first bonding pad and the second bonding pad, respectively. The first bonding pad and the first core pad are embedded in the first bonding layer. The second bonding pad and the second core pad are embedded in the second bonding layer. A package structure is also provided.