Package Substrate Pad Offset for Dense Interconnect Bonding
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Solution Overview
Problem
Conventional package substrates with build-up circuit structures struggle to support high-density interconnection required for advanced electronic components, failing to meet the demands of miniaturization and higher circuit densities while maintaining a simple manufacturing process.
Innovation Solution
A package substrate design featuring a redistribution structure with a core, where the core pad is directly bonded to the bonding pad without foreign materials, and offset to reduce dimensional tolerance, combined with a conductive and dielectric portion alternation in bonding layers for enhanced mechanical stability and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional build-up circuit structures are used, then manufacturing process is simple, but high-density interconnection cannot be supported
Solution Approach 1:
The invention divides the package substrate into distinct functional segments: a core substrate providing mechanical support and basic interconnection, and a redistribution substrate providing high-density interconnection capabilities. This segmentation allows each substrate to be optimized independently, enabling high circuit density on the redistribution substrate without requiring the entire manufacturing process to become complex.
Solution Approach 2:
The invention transitions from a single-plane build-up circuit structure to a multi-layer stacked configuration with the core substrate and redistribution substrate bonded together. This dimensional change enables high-density interconnection through vertical integration, allowing complex routing in the Z-direction while maintaining simpler manufacturing processes on each individual substrate layer.
2Ease of manufacture
If core pad is directly bonded to bonding pad without foreign materials, then manufacturing complexity is reduced, but dimensional tolerance requirements increase
Solution Approach 1:
The invention employs an asymmetric bonding arrangement where the core pad is intentionally offset from direct alignment with the bonding pad. This asymmetric positioning creates a staggered configuration that reduces the cumulative effect of dimensional tolerances, as the bonding interface does not require precise co-location of both pad centers, thereby easing manufacturing precision requirements while maintaining process simplicity.
3Quantity of substance
If high-density interconnection is achieved, then circuit integration is improved, but mechanical stability deteriorates
Solution Approach 1:
The invention applies different structural qualities to different regions of the package substrate. The core substrate provides robust mechanical support with lower interconnection density, while the redistribution substrate provides high-density interconnection with optimized local structural features. This local differentiation allows high circuit density in specific areas without compromising the overall mechanical stability of the entire substrate assembly.
Solution Approach 2:
The invention creates a composite substrate structure by bonding together the core substrate and redistribution substrate, which may have different material compositions optimized for their respective functions. This composite construction combines the mechanical strength of the core substrate with the high-density interconnection capabilities of the redistribution substrate, achieving both mechanical stability and high circuit integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves robust high-density interconnection with improved mechanical stability and reduced manufacturing complexity, enabling high-quality electrical signal transmission and cost-effective production.
Implementation Method 1
the core has a first core pad disposed on the first core surface and directly bonded to the bonding pad
Data Source
AI summary
A package substrate including a first redistribution structure, a first bonding layer, a core, a second bonding layer and a second redistribution structure in a sequential order is provided. The first redistribution structure has a first redistribution surface and a first bonding pad disposed on the first redistribution surface. The second redistribution structure has a second redistribution surface and a second bonding pad disposed on the second redistribution surface. The core has a first core pad disposed on a first core surface, and a second core pad disposed on a second core surface opposite to the first core surface. The first core pad is directly bonded to first bonding pad and offset from first bonding pad. The first bonding pad and the first core pad are embedded in the first bonding layer. The second core pad is contacting the second bonding pad through a conductive portion of the second bonding layer. A package structure is also provided.