Semiconductor Package Substrate Cavity Layout for Stacked Passive Devices
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving high electrical performance, compact size, and efficient packaging due to limitations in the integration and connection of passive devices within the substrate.
Innovation Solution
A semiconductor package substrate with a cavity structure that houses multiple passive devices, where each device is connected to the substrate through distinct conductive pads, allowing for independent electrical connections and reduced thickness, enabling increased electrical properties and design flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If passive devices are mounted on the surface of the substrate, then ease of manufacture is improved, but device complexity and package size increase
Solution Approach 1:
The patent embeds passive devices within cavities formed in the substrate, creating a nested structure where devices are housed inside the substrate volume rather than mounted on the surface. This nesting approach reduces the overall package footprint and eliminates the need for separate mounting areas, thereby reducing device complexity while maintaining manufacturing feasibility through standardized cavity formation processes.
Solution Approach 2:
The invention transitions from two-dimensional surface mounting to three-dimensional integration by forming cavities within the substrate volume. This dimensional change allows passive devices to be positioned in the vertical dimension within the substrate thickness, enabling higher density integration and reducing the horizontal package size without complicating the manufacturing process.
2Reliability
If multiple passive devices are integrated in the substrate, then electrical characteristics are improved, but manufacturing complexity increases
Solution Approach 1:
The substrate is divided into multiple discrete cavities, each housing a passive device. This segmentation allows for independent formation and testing of each cavity-device assembly, simplifying the manufacturing process. The segmented approach enables standardized production techniques to be applied to each segment, maintaining manufacturing simplicity while achieving superior electrical characteristics through integrated multi-device configuration.
Solution Approach 2:
The substrate structure serves multiple functions simultaneously: it provides mechanical support, forms electrical interconnections through conductive vias, and houses multiple passive devices within its cavities. This multi-functionality reduces the need for separate components and interconnection structures, thereby improving electrical characteristics without proportionally increasing manufacturing complexity.
3Length of stationary object
If passive devices are disposed in cavities, then package thickness is reduced, but ease of manufacture deteriorates
Solution Approach 1:
The cavities are formed in the substrate before the passive devices are installed. This preliminary action allows for precise cavity positioning and dimensioning to be performed using standard substrate processing techniques, maintaining manufacturing ease. The pre-formed cavities then receive the passive devices, which are subsequently connected to conductive pads through simple bonding processes, achieving reduced package thickness without significantly complicating the overall manufacturing sequence.
Data Source
AI summary
A semiconductor package substrate includes a substrate having a bottom surface including a cavity structure defined therein. The cavity structure includes a floor surface. A passive device structure has at least a partial portion of the passive device structure disposed in the cavity structure. The passive device structure includes a first passive device and a second passive device that are each electrically connected to the floor surface of the cavity structure. At least partial portions of the first passive device and the second passive device vertically overlap each other.