Perimeter-Reinforced Package Substrate for Multi-Chip Warpage Control
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Solution Overview
Problem
Semiconductor packages face issues with warpage due to the mounting of multiple semiconductor devices and inadequate heat dissipation, which existing technologies fail to effectively address.
Innovation Solution
Incorporating a reinforcing structure within the package substrate that extends along the perimeters of the mounting regions and is bonded to dummy patterns, providing structural support and utilizing high thermal conductivity materials to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are mounted on one semiconductor substrate through flip chip bonding technology, then the system integrates multiple devices in a compact package, but warpage of the semiconductor substrate occurs
Solution Approach 1:
The patent applies local quality by placing reinforcing structures at specific locations (along perimeters of mounting regions) rather than uniformly across the entire substrate. This targeted approach provides local support where warpage occurs due to device mounting, while maintaining the overall flexibility and integration benefits of the multi-device package.
Solution Approach 2:
The patent uses composite materials by combining the semiconductor substrate with reinforcing structures made of different materials having complementary properties. The reinforcing structures are bonded to dummy patterns on the substrate, creating a composite system that maintains both the electrical functionality and structural stability under thermal and mechanical stress.
2Adaptability or versatility
If multiple semiconductor devices are mounted on one semiconductor substrate, then device integration is achieved, but heat dissipation becomes inadequate
Solution Approach 1:
The patent introduces heat dissipation structures as intermediary elements between the semiconductor devices and the external environment. These structures are integrated with the substrate and providing pathways for heat to transfer from the mounted devices through the substrate to external heat sinks, effectively managing thermal accumulation in multi-device configurations.
3Stability of the object's composition
If a reinforcing structure is added to prevent warpage, then structural stability improves, but the manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by forming the reinforcing structures and bonding them to dummy patterns on the substrate before mounting the semiconductor devices. This sequence integrates the reinforcement process into the existing manufacturing flow, avoiding the need for additional post-assembly steps and reducing overall manufacturing complexity while ensuring structural stability from the outset.
4Strength
If the reinforcing structure is buried in the first surface of the package substrate, then the supporting force increases, but the available area for mounting devices decreases
Solution Approach 1:
The patent applies segmentation by dividing the substrate into distinct functional zones: mounting regions for semiconductor devices and separate regions for reinforcing structures. The reinforcing structures are positioned along perimeters of mounting regions and bonded to dummy patterns, effectively segmenting the substrate to provide structural support without encroaching on the active device mounting areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcing structure effectively prevents warpage and improves thermal conductivity, maintaining package size while efficiently dissipating heat generated by the semiconductor devices.
Implementation Method 1
Since the reinforcing structure may include a metal material having high thermal conductivity, heat generated from the first and second semiconductors may be discharged to outside the semiconductor package
Data Source
AI summary
A semiconductor package may include a package substrate having a first surface and a second surface vertically opposite to each other, a first mounting region and a second mounting region horizontally spaced apart from each other, and first and second semiconductor devices respectively mounted on the first and second mounting regions on the first surface of the package substrate. The package substrate may include wiring patterns electrically connected to the first and second semiconductor devices, dummy patterns electrically insulated from the first and second semiconductor devices, and a reinforcing structure that extends along perimeters of the first and second mounting regions on the first surface of the package substrate, and is bonded to at least portions of the dummy patterns.