Package Substrate Power Pad Segmentation for Noise Testing
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Solution Overview
Problem
Existing semiconductor technologies face challenges in accurately measuring power supply noise within chips due to all power supply pins being connected together, which prevents precise noise testing and results in inaccurate external noise measurements.
Innovation Solution
A package substrate design where power supply pads belonging to the same type are divided into a test pad and a power supply pad set, with the test pad being electrically connected to a separate test pin and test point on a test board, allowing for independent noise testing of internal power supplies within the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If all power supply pins are connected together, then power supply stability is improved, but noise testing accuracy deteriorates
Solution Approach 1:
The patent divides power supply pins into two distinct groups: a first power supply pin set that remains connected together for power supply stability, and a second power supply pin that is separated to enable independent noise testing. This segmentation allows the system to maintain both stable power supply and accurate noise measurement capabilities simultaneously.
Solution Approach 2:
The patent extracts one power supply pin from the main power supply network to create a dedicated test pin. This extracted pin is connected to a test point on the test board, allowing noise measurement without being affected by the connections of other power supply pins. This extraction enables independent noise testing while the remaining pins maintain stable power supply connections.
2Power
If power supply pads are connected together, then power distribution is improved, but external noise measurement accuracy deteriorates
Solution Approach 1:
The patent segments power supply pads into a first power supply pad set (connected together for power distribution) and a second power supply pad (separated for testing). This segmentation enables both effective power distribution across the chip and accurate external noise measurement through the isolated test pad.
Solution Approach 2:
The patent extracts one power supply pad from the main power distribution network and connects it to a test point on the test board. This extraction allows external noise measurement without the pad being influenced by the power distribution connections of other pads, while the remaining pads continue to provide stable power distribution.
3Reliability
If test pad is connected to power supply pad set, then power supply is maintained, but noise testing independence is lost
Solution Approach 1:
The patent creates a clear segmentation between the test pad and power supply pad set, with the test pad having no electrical connection to the power supply pad set. This segmentation ensures that noise testing operations remain independent and do not interfere with power supply maintenance, while both functions can coexist on the same package substrate.
Solution Approach 2:
The patent extracts the test pad from the power supply network entirely, connecting it only to the test point on the test board. This extraction ensures complete electrical isolation between the testing function and the power supply function, allowing noise testing to be performed independently without affecting power supply stability.
Data Source
AI summary
A package substrate, an apparatus for testing power supply noise, and a method for testing power supply noise are provided. The package substrate includes multiple pad arrays, and each of the multiple pad arrays at least includes power supply pads. Power supply pads belonging to a same power supply type in the multiple pad arrays are divided into a test pad and a power supply pad set. The power supply pad set includes power supply pads, other than the test pad, among the power supply pads belonging to the same power supply type, all the power supply pads in the power supply pad set are electrically connected together, and the test pad is configured to perform noise testing of at least one internal power supply corresponding to the same power supply type in a chip to be tested.