Package Substrate Power Sharing Between Integrated Device Cores
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Solution Overview
Problem
Existing packages with integrated devices struggle to optimize power distribution, leading to suboptimal performance as power resources are not efficiently shared between cores or devices.
Innovation Solution
Incorporating a substrate with power interconnects and switches that allow for the rerouting of power resources from one core or device to another, enabling dynamic power sharing based on demand.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If power resources are separately allocated to each core or integrated device, then each core has dedicated power supply, but power distribution efficiency deteriorates and system performance is suboptimal
Solution Approach 1:
The patent implements power sharing interconnects that allow power resources to serve multiple cores or integrated devices simultaneously. The substrate includes power sharing interconnects configured to receive power from a first power resource and provide that power to a second core or integrated device, enabling a single power source to fulfill multiple power supply needs across the package.
Solution Approach 2:
The patent employs dynamic power allocation through controllable switches or transistors integrated into the substrate. These switching elements can dynamically route power from different power resources to different cores or integrated devices based on real-time power demands, allowing the system to adapt power distribution to changing operational requirements.
2Reliability
If dedicated power interconnects are provided for each core, then power supply reliability is maintained, but adaptability of power distribution deteriorates
Solution Approach 1:
The patent segments the power distribution network into multiple controllable paths within the substrate. Power sharing interconnects are divided into discrete routing paths with individual switching elements, allowing selective activation of specific power routes while maintaining others in standby, thus preserving reliability through redundancy while enabling adaptability through selective routing.
Solution Approach 2:
The substrate acts as an intermediary between power resources and cores/integrated devices. The power sharing interconnects and switching elements within the substrate mediate power flow, providing controlled access that maintains reliable power supply while enabling flexible redistribution of power based on system needs.
3Loss of energy
If power sharing capability is added to the substrate, then power distribution efficiency improves, but device complexity increases
Solution Approach 1:
The patent merges power sharing functionality directly into the substrate structure, combining power distribution, switching control, and routing functions into a single integrated substrate layer. This consolidation eliminates the need for separate power management components, reducing overall system complexity while maintaining power distribution efficiency.
Solution Approach 2:
The substrate is designed with multi-functional power sharing interconnects that can serve multiple purposes: dedicated power supply, shared power distribution, and dynamic power rerouting. This universal design approach consolidates multiple power management functions into a single structure, improving efficiency without proportionally increasing complexity.
4Adaptability or versatility
If dynamic power rerouting is implemented, then system adaptability improves, but control complexity increases
Solution Approach 1:
The patent implements self-service power management where the system automatically monitors power demands of cores and integrated devices and dynamically reroutes power through the switching elements without external intervention. The power sharing interconnects and switches operate autonomously based on detected power requirements, reducing control complexity while maintaining high adaptability.
Solution Approach 2:
The dynamic power rerouting system incorporates feedback mechanisms that monitor power consumption levels of individual cores and integrated devices. This feedback information is used by the switching control logic to automatically adjust power distribution in real-time, enabling adaptive power allocation while keeping control mechanisms relatively simple through rule-based decision making.
Data Source
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AI summary
A package that includes a substrate and integrated device coupled to the substrate. The integrated device includes a first core and a second core. The substrate includes a first power interconnect configured to provide a first electrical path for a first power resource to the first core of the integrated device. The substrate includes a second power interconnect configured to provide a second electrical path for a second power resource to the second core of the integrated device. The substrate includes a switch coupled to the first power interconnect and the second power interconnect, where if the switch is turned on, the switch is configured to enable at least some of the power resource from the second power resource to contribute to the first core of the integrated device.