Package Substrate Rear Openings for Stable Passive Device Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor packages with high-performance chips face issues such as malfunctions and performance degradation due to voltage noise in the high-frequency band, and passive devices mounted on the rear surface are prone to tilting or shifting during assembly.
Innovation Solution
A package substrate design with a redistribution layer, protective layers, and specific openings to stabilize passive devices, including first and second rear openings that prevent tilting and ensure adequate underfill resin flow, enhancing the reliability of the semiconductor package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive devices are mounted on the rear surface of the semiconductor package, then power integrity characteristics are improved by removing voltage noise, but the passive devices are prone to tilting or shifting during assembly
Solution Approach 1:
The rear surface of the package substrate is divided into multiple mounting regions, with each region containing specific patterns of protrusions. These protrusions are segmented and distributed to provide localized support points for passive devices, preventing tilting and shifting while maintaining power integrity benefits
Solution Approach 2:
Different regions of the package substrate have different local structures - some areas have protrusions for mechanical support, while other areas have through-holes for electrical connection. This local differentiation allows the substrate to simultaneously provide mechanical stability and electrical functionality in appropriate locations
2Adaptability or versatility
If the rear surface of the package substrate is used for mounting passive devices, then the semiconductor package functionality is enhanced, but the passive devices may tilt or shift during assembly
Solution Approach 1:
The protrusions are pre-formed on the package substrate before passive device mounting. This preliminary structural preparation ensures that when passive devices are placed on the substrate, they immediately receive mechanical support at predetermined locations, preventing tilting and shifting during assembly
Solution Approach 2:
The protrusions act as intermediary elements between the package substrate and the passive devices. These intermediary structures provide the necessary mechanical interface that transfers and distributes mounting forces, stabilizing the passive devices while allowing electrical connections through separate through-holes
Data Source
AI summary
A semiconductor package includes a package substrate including a base substrate including a redistribution layer, pads disposed on first and second surfaces of the base substrate and connected to the redistribution layer, and a protective layer having a mounting region in which first openings respectively exposing first pads among the pads and a second opening exposing second pads among the pads and a portion of the second surface are disposed on the second surface; a semiconductor chip disposed on the mounting region and connected to the pads through the first openings and the second opening; and a sealing material covering a portion of the semiconductor chip and extending into the second opening. Four first openings among the first openings are respectively disposed adjacent to respective corners of the mounting region. The second opening is disposed to divide the four first openings into at least two groups.