Package Substrate Stacking With Release Layer for Thin Fabrication
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Solution Overview
Problem
Conventional package substrates face challenges in achieving thinness, low warpage, high density patterns, and laser vias while avoiding damage and requiring expensive processing equipment, leading to increased production costs.
Innovation Solution
A method involving stacking and bonding two thin substrate bodies through a bonding and release layer, with laser-sealed channels and alignment marks, to enhance processing capabilities of general equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If general processing equipment is used to produce thin package substrates, then production cost is reduced, but the substrates are prone to damage and processability is limited
Solution Approach 1:
The substrate fabrication process is divided into multiple stages: forming substrate bodies on first substrates, bonding to release layer, forming conductors and wire layers, separating from first substrates, bonding to second substrates. This segmentation allows each stage to be optimized independently, enabling use of general equipment while maintaining substrate integrity through controlled separation and bonding operations
Solution Approach 2:
The release layer serves as an intermediary between the first substrate bodies and second substrates. It enables temporary support during fabrication using general equipment, then allows clean separation to transfer substrates to final mounting substrates, preventing damage while maintaining processability
2Length of stationary object
If substrate thickness is reduced to meet thinness requirements, then packaging size is reduced, but substrates become more susceptible to damage
Solution Approach 1:
Substrate bodies are formed on first substrates before final assembly, allowing thin substrates to be created with the support of thicker first substrates that provide mechanical strength during fabrication. The preliminary formation on supported substrates prevents damage, then separation transfers the thin completed substrates to final mounts
Solution Approach 2:
The patent changes the thickness parameter of substrates at different stages: first substrates have greater thickness for support during fabrication, while final package substrates achieve reduced thickness for size requirements. Bonding and separation operations enable this parameter transformation while maintaining integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of thinner package substrates with improved reliability and reduced production costs by utilizing standard processing equipment.
Implementation Method 1
disposing the first substrate body and the second substrate body on both sides of the bonding layer
Implementation Method 2
bonding the first substrate body and the second substrate body to two opposite sides of a release layer via the first surface of the first substrate body and the first surface of the second substrate body, respectively; and separating the first substrate body, the second substrate body and the release layer
Implementation Method 3
forming a plurality of conductors in the first substrate body and the second substrate body; forming a first patterned wire layer on each of the first surfaces
Data Source
AI summary
A method of fabricating a package substrate is provided. The method is to stack and bond a first substrate body and a second substrate body by a bonding layer and a release layer to increase the overall thickness, so that the limitations of general processing equipment on substrate thickness can be overcome.