Package Design Substrate Segmentation and Seam Integration
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Solution Overview
Problem
Existing automated package customization systems face challenges in accommodating varied desired package sizes, often resulting in inefficient use of substrates with significant waste, as they are limited by available substrate sizes and struggle to fit complex structures without adverse effects on functional connections or assembly ease.
Innovation Solution
A system that generates package design files by identifying cut and fold line instructions to split a three-dimensional structure across multiple substrates, converting selected fold lines to seams, and imparting functional elements to ensure efficient substrate use and maintain structural integrity and ease of assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a single substrate is used for package construction, then substrate usage is simplified and processing is easier, but significant wasted space occurs and large packages cannot be accommodated
Solution Approach 1:
The package flat is divided into multiple substrates by converting a fold line to a seam, creating separate substrate units that can be processed independently. This segmentation allows each substrate to be optimized for its specific portion of the package, reducing overall waste while maintaining the ability to construct the complete package structure.
2Adaptability or versatility
If the package structure is designed to fit available substrate sizes, then production is simplified, but packages with dimensions exceeding substrate limits cannot be created
Solution Approach 1:
By dividing the package flat across multiple substrates separated by seams, the system can accommodate package dimensions that exceed single substrate limits. The segmentation allows flexible combination of standard substrate sizes to create larger or more complex package structures without requiring custom oversized substrates.
Solution Approach 2:
The seam acts as an intermediary element that connects multiple substrates to form a continuous package flat. This intermediary structure enables the system to bridge the gap between limited substrate dimensions and larger package requirements, maintaining manufacturing simplicity while expanding design capabilities.
3Area of stationary object
If fold lines are converted to seams to enable multi-substrate construction, then substrate waste is reduced and larger packages are enabled, but functional connections may be adversely affected
Solution Approach 1:
The seam serves as a controlled intermediary that replaces the fold line while maintaining the necessary structural and functional connections. By carefully designing the seam configuration and associated functional elements, the system preserves connection integrity between package facets even though the continuous fold line has been divided into separate substrate segments.
Solution Approach 2:
The system applies different properties to different regions: fold lines remain in areas where continuous bending is needed, while seams are strategically placed in areas where substrate separation is beneficial for waste reduction. This localized differentiation maintains functional connections where needed while enabling multi-substrate construction where appropriate.
4Loss of substance
If multiple substrates are used to reduce waste and accommodate large packages, then substrate utilization improves, but the complexity of imparting cut lines and fold lines across multiple substrates increases
Solution Approach 1:
The package flat is segmented into multiple substrates with clearly defined boundaries at seam locations. This segmentation allows the cutting and creasing operations to be performed independently on each substrate, simplifying the overall process despite the increased number of substrates. Each substrate can be processed through standard equipment without requiring complex coordinated operations across multiple pieces.
Data Source
AI summary
A package design system creates one or more package design files by creating cut line instructions and fold line instructions. If the system determines that the package should be split across two or more substrates, it will select a fold line and convert the selected fold line to a seam. Conversion to a seam may occur by creating cut line instructions for the selected fold line, imparting a first set of functional elements on a first side of the seam, and imparting a second set of functional elements on a second side of the seam. The first set of functional elements and the second set of functional elements will form a functional connection when the three-dimensional structure is formed.