Package Substrate Copper Layer Etching in a Single Removal Step
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional package substrate manufacturing methods require two etching processes, prolonging process time and increasing material and production costs due to the need for a protection layer to protect the second circuit layer.
Innovation Solution
A method where the first and second metal layers are simultaneously removed by etching after the insulating board body is removed, reducing the process to a single etching step and eliminating the need for a protection layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If two etching processes are used to remove the first and second copper layers respectively, then the circuit structure can be formed, but the process time is lengthened and productivity deteriorates
Solution Approach 1:
The patent combines two separate etching processes into a single etching step by removing both the first copper layer and the second copper layer simultaneously. This is achieved by removing the insulating board body first, then performing one etching process to remove both copper layers, eliminating the need for sequential etching and the associated protection layer
Solution Approach 2:
The insulating board body is removed before the copper layers, which enables the subsequent single etching process to access and remove both copper layers efficiently. This preliminary removal of the insulating board body sets up the conditions for the combined etching operation
2Reliability
If a protection layer is formed to protect the second circuit layer during the second etching process, then the second circuit layer is protected from damage, but material cost increases
Solution Approach 1:
The patent extracts and eliminates the protection layer from the manufacturing process by changing the sequence of operations. Instead of forming a protection layer to shield the second circuit layer during etching, the method removes the insulating board body first, allowing both copper layers to be etched simultaneously without needing protection
Solution Approach 2:
By merging the removal of both copper layers into a single etching process, the patent eliminates the need for the protection layer that would otherwise be required to protect the second circuit layer during a second etching step
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces process time and manufacturing costs by eliminating the need for a protection layer, thereby enhancing productivity and cost-effectiveness.
Implementation Method 1
removing the first metal layer and a portion of the second metal layer simultaneously
Data Source
AI summary
A manufacturing method of a package substrate is provided, the manufacturing method includes forming a first circuit layer on a first metal layer; forming a dielectric layer on the first metal layer and the first circuit layer; forming a second metal layer on the dielectric layer; forming a plurality of conductive blind vias in the dielectric layer and forming a second circuit layer on the second metal layer, where the plurality of conductive blind vias are electrically connected to the first circuit layer and the second circuit layer; and removing the first metal layer and a portion of the second metal layer simultaneously. Therefore, in the manufacturing method, the first metal layer and the second metal layer can be removed by one etching process, such that the time for manufacturing the package substrate can be greatly reduced to increase production quantity.