Package Substrate Solder Ball Layout for Low-Crosstalk Pin Density
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Solution Overview
Problem
The challenge in chip packaging technology is to achieve a high-density pin arrangement on package substrates while minimizing electromagnetic crosstalk, as increased pin density exacerbates crosstalk issues, affecting the performance and manufacturing costs of semiconductor packages.
Innovation Solution
The solution involves arranging solder balls in a parallelogram shape on the package substrate, with specific positioning to reduce crosstalk, and incorporating ground solder balls to further minimize electromagnetic interference, allowing for a high-density and low-crosstalk pin arrangement mode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If pin arrangement density is increased on the package substrate, then the package area is reduced and manufacturing cost is lowered, but electromagnetic crosstalk between pins is aggravated
Solution Approach 1:
The patent divides the package substrate into multiple unit regions, each containing a specific arrangement of solder balls. This segmentation allows for optimized signal routing and grounding within each unit, reducing electromagnetic crosstalk while maintaining high density. The substrate body is partitioned into discrete functional blocks that can be independently designed and analyzed.
Solution Approach 2:
The patent implements different solder ball arrangements in different unit regions based on their specific functional requirements. Each unit region can have customized signal and ground solder ball configurations optimized for its particular signal types and crosstalk characteristics, rather than applying a uniform arrangement across the entire substrate.
Solution Approach 3:
The patent introduces ground solder balls as intermediary elements between signal solder balls. These ground solder balls act as electromagnetic shields and reference planes, reducing crosstalk between adjacent signal pins while maintaining compact spacing. The ground elements serve as mediators that manage electromagnetic fields in high-density arrangements.
2Productivity
If pin arrangement density is increased on the package substrate, then manufacturing cost is reduced, but signal integrity is degraded due to electromagnetic interference
Solution Approach 1:
By segmenting the substrate into unit regions with controlled signal and ground solder ball arrangements, the patent maintains signal integrity through localized electromagnetic field management. This allows high-density packaging without compromising signal quality, as each unit region can be optimized for its specific signal requirements.
Solution Approach 2:
Ground solder balls are positioned as intermediaries between signal solder balls to provide electromagnetic shielding and reference planes. This intermediary grounding structure prevents signal interference while maintaining the high-density arrangement needed for cost-effective manufacturing.
3Area of moving object
If solder balls are arranged in a parallelogram shape, then arrangement density is increased and package area is reduced, but electromagnetic crosstalk may be aggravated without proper positioning
Solution Approach 1:
The patent uses asymmetric positioning of ground solder balls relative to signal solder balls within the parallelogram arrangement. The ground solder balls are positioned at specific locations that are not symmetrically equivalent to all signal balls, creating optimized electromagnetic field patterns that reduce crosstalk while maintaining compact area.
Solution Approach 2:
The patent transitions from considering only the two-dimensional parallelogram geometry to incorporating the vertical dimension of electromagnetic field distribution. By strategically positioning ground solder balls in three-dimensional space relative to signal balls, the patent manages electromagnetic fields in multiple dimensions to reduce crosstalk while maintaining planar density.
Data Source
AI summary
The technology of this application relates to a package substrate that includes a substrate body. Each unit region includes at least one solder ball group. The solder ball group includes a first solder ball, a second solder ball, a third solder ball, a fourth solder ball, a fifth solder ball, and a sixth solder ball that are arranged at spacings. The first solder ball, the second solder ball, the third solder ball, and the fourth solder ball are respectively located at four vertices of a parallelogram, and the second solder ball and the third solder ball each are adjacent to the first solder ball. The fifth solder ball is provided on a side of the parallelogram and is located between the first solder ball and the third solder ball. The sixth solder ball is provided on another side of the parallelogram and is located between the second solder ball and the fourth solder ball.