Substrate design for semiconductor package and manufacturing method thereof

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Solution Overview

Problem

Advanced substrates for semiconductor packages are required to enhance electrical performance while reducing stresses, which existing technologies have not adequately addressed.

Innovation Solution

A substrate design incorporating a non-organic core with a ceramic material and a wrapped dielectric layer, which includes a ceramic material and a wrapped dielectric layer, which enhances electrical performance and reduces stresses, which existing technologies have not adequately addressed.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If advanced substrates are introduced for enhanced electrical performance, then electrical performance is improved, but stresses in the semiconductor packages increase

Engineering Contradiction:

Improveelectrical performanceVSAvoidstresses

Core Design Contradiction:

ReliabilityVSStress or pressure

Solution Approach 1:

The substrate employs a composite structure consisting of a non-organic core layer (ceramic material) and an organic outer layer (polymer material). This composite design allows the non-organic core to provide excellent electrical performance and low stress, while the organic outer layer provides mechanical flexibility and stress distribution, thereby resolving the contradiction between enhanced electrical performance and reduced stresses.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent modifies the material composition parameters of the substrate by introducing a layered structure with different material properties. The non-organic core layer has specific dielectric constant and loss tangent values that optimize electrical performance, while its mechanical properties are balanced with the organic outer layer to control stress levels, thus resolving the technical contradiction through parameter optimization.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If non-organic core with ceramic material is used, then electrical performance is enhanced, but manufacturing complexity increases

Engineering Contradiction:

Improveelectrical performanceVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The substrate is segmented into distinct functional layers: a non-organic core layer for electrical performance and an organic outer layer for mechanical properties. This segmentation allows each layer to be optimized independently for its specific function, simplifying the manufacturing process by enabling separate fabrication and assembly of layers with different material requirements, thereby reducing overall manufacturing complexity while maintaining enhanced electrical performance.

Inventive Principle:

Principle #1Segmentation

Data Source

PatentUS20250391757A1Substrate design for semiconductor package and manufacturing method thereof

Publication Date: 2025.12.25 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A substrate structure includes a first core structure and a build-up structure. The first core structure includes a first side, a second side opposite to each other, a first core layer, and a first core dielectric layer wrapping around the first core layer, where the first core layer is non-organic. The build-up structure is disposed on the first and second sides of the first core structure, the build-up layer includes a first dielectric layer at least covering the first side of the first core structure, and materials of the first dielectric layer and the first core dielectric layer are different.