Semiconductor Package Substrate Holes for Thermal Stress Relief

The patent divides the substrate into multiple segments by forming holes through it. These holes create discrete regions that can independently accommodate thermal expansion differences, preventing stress accumulation across the entire large package area. The substrate is effectively segmented into multiple smaller stress zones, each capable of handling thermal stress independently.

The patent introduces a porous structure into the substrate by forming holes through it. This porous configuration allows the substrate to better accommodate thermal expansion mismatches between the semiconductor die and substrate materials. The holes provide void spaces that can compress or expand during thermal cycling, reducing stress transmission and preventing warping or cracking in large packages.

The substrate is segmented into multiple regions by forming holes through it. This segmentation creates discrete zones that can independently manage thermal stress, improving overall substrate stability. The holes divide the continuous substrate structure into multiple smaller stable regions, each capable of accommodating local thermal expansion without compromising the entire substrate.

A porous structure is introduced into the substrate by forming holes through it. This porous configuration provides a simple yet effective mechanism for stress relief without requiring complex multi-layer or composite structures. The holes create void spaces that naturally accommodate thermal stress through compression or expansion, maintaining substrate stability with minimal structural complexity.