Package Substrate Lamination for Ultra-Thin, Low-Warpage Wiring
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Solution Overview
Problem
Conventional fabricating methods for package substrates face challenges in producing thin, low warpage, and high-density wiring designs due to the risk of substrate damage and the need for specialized apparatus, leading to high production costs.
Innovation Solution
A method involving the use of carriers and support boards to laminate thin substrates, forming conical conductive pillars, and controlling the substrate thickness through batch processing to prevent warpage and damage, allowing existing processing apparatus to handle ultra-thin substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional fabricating methods are used for package substrates, then existing apparatus can be utilized, but the substrate thickness cannot be reduced below a certain limit due to damage risk
Solution Approach 1:
The patent applies preliminary action by forming a protective coating layer on the substrate surface before thinning the substrate. This coating layer is created in advance to prevent damage during subsequent processing steps, allowing the substrate to be thinned to ultra-thin dimensions while maintaining structural integrity and preventing breakage during handling and assembly.
Solution Approach 2:
The patent implements beforehand cushioning by introducing a protective coating layer that acts as a cushioning barrier on the substrate surface. This coating provides mechanical protection and stress distribution before the substrate undergoes thinning and subsequent processing, preventing direct damage to the fragile thin substrate structure.
2Length of moving object
If specialized apparatus with special specifications is used to produce thin substrates, then substrate thickness requirements are met, but production costs increase
Solution Approach 1:
The patent applies universality by developing a fabricating method that can be implemented using existing standard apparatus rather than requiring specialized equipment. The process uses conventional coating formation techniques and standard thinning procedures that are already available in production facilities, making the ultra-thin substrate manufacturing capability accessible without additional capital investment in specialized apparatus.
Solution Approach 2:
The patent employs parameter changes by modifying the substrate thickness parameter to ultra-thin dimensions while adjusting the coating layer properties and processing parameters to accommodate the thin substrate. By changing the thickness parameter and corresponding process parameters, the method achieves cost-effective production of ultra-thin substrates using existing equipment capabilities.
3Length of moving object
If thin substrates are produced to meet high integration requirements, then miniaturization is achieved, but warpage control becomes difficult
Solution Approach 1:
The patent applies local quality by creating a coating layer with specific properties localized on the substrate surface. This coating layer has different mechanical properties than the substrate bulk, providing localized stress compensation and warpage control on the thin substrate surface while allowing the overall miniaturized structure to be maintained.
Solution Approach 2:
The patent employs composite materials by combining the substrate material with a coating layer material to create a composite structure. This composite provides both the thin profile needed for miniaturization and the enhanced mechanical properties including warpage resistance, achieving both goals simultaneously through material composition rather than relying solely on substrate thickness.
Data Source
AI summary
A fabricating method of a package substrate is provided, in which two thinnable substrates are laminated onto a carrier to increase the structural thickness during the manufacturing process, so that circuit layers on the substrates can be fabricated with existing processing apparatus. Therefore, the fabricating method may be used for any ultra-thin substrate, and the performance of the existing processing apparatus is sufficient to meet the requirements of the manufacturing process, such that the ability to produce the minimum board thickness may be achieved.